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Lead free solders are increasingly being used in electronic applications. Eutectic Sn–Cu solder alloy is one of the most favored lead free alloys used for soldering in electronic applications. It is inexpensive and principally used in wave soldering. Wetting of liquid solder on a substrate is a case of reactive wetting and is accompanied by the formation of intermetallic compounds (IMCs) at the interface. Wettability of Sn–0.7Cu solder on metallic substrates is significantly affected by the temperature and the type of flux. The wettability and microstructural evolution of IMCs at the Sn–0.7Cu solder/substrate interfaces are reviewed in the present paper. The reliability of solder joints in electronic packaging is controlled by the type and morphology of interfacial IMCs formed between Sn–0.7Cu solder and substrates. The formation and growth mechanisms of interfacial IMCs are highlighted. Mechanical behavior of bulk solder …