作者
John Lau, Ricky Lee, Matthew Yuen, Philip Chan
发表日期
2010/5/11
期刊
Microelectronics International
卷号
27
期号
2
页码范围
98-105
出版商
Emerald Group Publishing Limited
简介
Purpose
–
The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages.
Design/methodology/approach
–
These packages consist of the multi‐LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed.
Findings
–
The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor.
Originality/value
–
A thermal management system for 3D IC and LEDs integration packages is proposed.
学术搜索中的文章
J Lau, R Lee, M Yuen, P Chan - Microelectronics International, 2010