作者
Houqiang Fu, Kai Fu, Chen Yang, Hanxiao Liu, Kevin A Hatch, Prudhvi Peri, Dinusha Herath Mudiyanselage, Bingjun Li, Tae-Hyeon Kim, Shanthan R Alugubelli, Po-Yi Su, Daniel C Messina, Xuguang Deng, Chi-Yin Cheng, Reza Vatan Meidanshahi, Xuanqi Huang, Hong Chen, Tsung-Han Yang, Jingan Zhou, Andrew M Armstrong, Andrew A Allerman, T Yu Edward, Jung Han, Stephen M Goodnick, David J Smith, Robert J Nemanich, Fernando A Ponce, Yuji Zhao
发表日期
2021/10/1
来源
Materials Today
卷号
49
页码范围
296-323
出版商
Elsevier
简介
This paper reviews materials challenges and recent progress for selective area regrowth and doping for vertical gallium nitride (GaN) power devices. The purpose is to realize randomly placed, reliable, contactable, and generally useable laterally patterned p-n junctions, which are the building blocks for various advanced power rectifiers and transistors. The general regrowth process and regrowth dynamics in trenches were discussed, where the effects of trench geometries, growth methods, and bulk substrates were elucidated. Comprehensive materials characterization techniques were utilized to analyze the regrown structures, including scanning electron microscopy, transmission electron microscopy, atom probe tomography, scanning probe microscopy, and secondary-ion mass spectrometry. Cathodoluminescence and secondary electrons in scanning electron microscopy and atom probe tomography were …
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