作者
HS Yuan, X Lu, YC Dai, KD Hyde, YH Kan, I Kušan, SH He, NG Liu, VV Sarma, CL Zhao, BK Cui, N Yousaf, GY Sun, SY Liu, F Wu, CG Lin, MC Dayarathne, TB Gibertoni, LB Conceição, R Garibay-Orijel, M Villegas-Ríos, R Salas-Lizana, TZ Wei, JZ Qiu, ZF Yu, R Phookamsak, M Zeng, S Paloi, DF Bao, PD Abeywickrama, DP Wei, J Yang, IS Manawasinghe, D Harishchandra, RS Brahmanage, NI de Silva, DS Tennakoon, A Karunarathna, Y Gafforov, D Pem, SN Zhang, ALCM de Azevedo Santiago, JDP Bezerra, B Dima, K Acharya, J Alvarez-Manjarrez, AH Bahkali, VK Bhatt, TE Brandrud, TS Bulgakov, E Camporesi, T Cao, YX Chen, YY Chen, B Devadatha, AM Elgorban, LF Fan, X Du, L Gao, CM Gonçalves, LFP Gusmão, N Huanraluek, M Jadan, RS Jayawardena, AN Khalid, E Langer, DX Lima, NC de Lima-Júnior, CRS de Lira, JK Liu
发表日期
2020
期刊
S., Lumyong, S., Luo, ZL, Matočec, N., Niranjan, M., Oliveira-Filho, JRC, Papp, V., Pérez-Pazos, E., Phillips, AJL, Qiu, PL, Ren, YH, Castañeda-Ruiz, RF, Semwal, KC, Soop, K., de Souza, CAF, Souza-Motta, CM, Sun, LH, Xie, ML, Yao, YJ, Zhao, Q. & Zhou, LW
页码范围
1277-1386
简介
A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
