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The polymer nanocomposites with 3-dimensional (3D) nanofillers can form a 3D network and attain a uniform distribution of nanofillers, which benefits the transfer of charge carriers and phonons as well as the dispersion of stress at a very low loading of nanofillers. These polymer nanocomposites with high mechanical properties would have great potential for thermal and electrical conduction as well as electromagnetic interference (EMI) shielding. In this paper, the 3D epoxy nanocomposites are manufactured by stuffing epoxy resin into 3D p-phenylenediamine-aniline copolymer nanofibers@Cu foam (P-PANI@f-Cu) hybrid nanofillers that are constructed by electrophoretic deposition of phosphoric acid doped P-PANI copolymer nanofibers onto the surface of sodium hydroxide oxidized Cu foam. Benefiting from 3D continuous network of P-PANI@f-Cu hybrid nanofillers, the electrical conductivity and thermal …