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A novel vapor chamber was fabricated to assess the feasibility of combining hydrophobic and hydrophilic wettabilities in the evaporator to optimize thermal performance. The proposed vapor chamber included a separate layer of hydrophilic sintered copper powder wick that was pressed in intimate contact with a hydrophobic evaporator substrate with a water contact angle around 140°. The contact between the wick layer and the evaporator was provided by sixteen posts implemented on the condenser, which pushed the wick layer toward the evaporator. The thermal performance was evaluated based on the thermal resistance, source temperature, and temperature uniformity across the condenser. Results were compared with those of a baseline vapor chamber that was fabricated by sintering hydrophilic copper particles on a hydrophilic copper evaporator substrate. The wick size and the copper powders used to …