作者
W Zhang, DN Weiss, KM Krishnan
发表日期
2011/3/17
期刊
Journal of Micromechanics and Microengineering
卷号
21
期号
4
页码范围
045024
出版商
IOP Publishing
简介
A thermal nanoimprint process for the high-temperature (400 C) fabrication of submicron, epitaxial, metallic wire arrays over areas> 1× 1 cm 2 is reported. Based on a method using an imprinted polymeric bilayer resist template that is transferred to a metallic (molybdenum) mask, this process is enabled by an appropriate undercut profile of the Mo mask. The undercut profile is obtained from a distinctive wedge-shaped profile of the polymeric resist layers by carefully controlling the etch parameters. Using flexible ethylene tetrafluoroethylene imprint molds, we demonstrate defect-free imprinting on MgO substrates. Epitaxial patterning is demonstrated with Fe/MnPd bilayer wire arrays subsequently grown along well-defined crystallographic orientations. X-ray diffraction of the patterned arrays reveals that the MnPd can be grown in two different crystallographic orientations (c-axis and a-axis normals). The epitaxial nature …
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