Bridgid Wanjala

Bridgid Wanjala

Kayaku Advanced Materials Inc
在 kayakuam.com 的电子邮件经过验证
被引用次数：2641
Advanced Electronic Packaging Photoresist Chemistry Photopatterning Nanoparticles and … Surface Funct
Afshin Dadvand, Ph.D.

Afshin Dadvand, Ph.D.

Wolfspeed, Cummins, McGill University, National Research Council Canada (NRC), and …
在 mcgill.ca 的电子邮件经过验证
被引用次数：1872
R&D of emerging Materials & devices Advanced electronic packaging Printed flexible electronics and photonics Thin-film
Cheng-Chieh Li

Cheng-Chieh Li

Taiwan Semiconductor Manufacturing Company (tsmc)
被引用次数：555
Advanced electronic packaging Thermoeletric module Oxidation behavior
Sheng-Tsai Wu

Sheng-Tsai Wu

PowerX Semiconductor
在 alumni.itri.org.tw 的电子邮件经过验证
被引用次数：554
Advanced electronic packaging power module compound semiconductor design and simulation power
Mohammad Saiful Islam, PhD

Mohammad Saiful Islam, PhD

Senior Packaging R&D Engineer, Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：324
Advanced Electronic Packaging Heterogeneous Integration Power and Signal Integrity of Packaging
I. Alperen Ayhan

I. Alperen Ayhan

Senior R&D Engineer
在 sarasmicro.com 的电子邮件经过验证
被引用次数：279
Advanced Electronic Packaging R&D of PCB Materials Heterogeneous Integration Thin Films
Juheon Kim

Juheon Kim

UNIST mechanical engineering researcher
在 unist.ac.kr 的电子邮件经过验证
被引用次数：6
Molecular Dynamics Simulation Nanomechanics Advanced Electronic Packaging