Kristoffer Andersson

Kristoffer Andersson

Senior Specialist GaN mm-wave devices, Ericsson Research
在 ericsson.com 的电子邮件经过验证
被引用次数：2134
Heterogenous integration Widebandgap Semiconductors 6G mm-wave array antennas
Michael D. Sinanis, PhD, MBA

Michael D. Sinanis, PhD, MBA

Purdue University
在 purdue.edu 的电子邮件经过验证
被引用次数：860
In-Mold Electronics Heterogenous Integration MEMS Advanced Micromanufacturing
srivatsa rangachar srinivasa

srivatsa rangachar srinivasa

Research Scientist , Intel Labs
被引用次数：650
In-memory computing Near memory computing heterogenous integration ML hardware Low power circuit design
Harindra Kumar Kannojia

Harindra Kumar Kannojia

IMEC
在 imec.be 的电子邮件经过验证
被引用次数：305
LIFT heterogenous integration Cu-Sn SLID advanced Packaging MEMS
Evgenii Novoselov

Evgenii Novoselov

imec
在 imec.be 的电子邮件经过验证
被引用次数：276
heterogenous integration through silicon via wafer bonding
Emadreza Soltanian

Emadreza Soltanian

Ph.D. Fellow, Ghent University - imec
在 ugent.be 的电子邮件经过验证
被引用次数：120
Silicon Photonics Transfer Printing Tunable Narrow Linewidth Laser & SOA Heterogenous Integration
Bharath Shankaranarayanan

Bharath Shankaranarayanan

Staff Engineer, Synopsys Inc
在 synopsys.com 的电子邮件经过验证
被引用次数：10
3D DFT DFT 3D-IC Chiplets Heterogenous integration
Rohit Suthar

Rohit Suthar

Ph.D. Student, University of Texas at Arlington
在 mavs.uta.edu 的电子邮件经过验证
被引用次数：4
Electronics Packaging Reliability and Thermal Management Heterogenous Integration
Justin J. Kim

Justin J. Kim

University of California, Santa Barbara
在 ucsb.edu 的电子邮件经过验证
被引用次数：1
mm-Wave electronics RFIC design heterogenous integration