Douglas C.H. Yu

Douglas CH Yu

Taiwan Semiconductor Manufacturing Company Ltd.
在 tsmc.com 的电子邮件经过验证
被引用次数：47862
packaging 3D microelectronics interconnect semiconductor
Rafael Auras

Rafael Auras

Professor, School of Packaging, Michigan State University
在 msu.edu 的电子邮件经过验证
被引用次数：22596
polymers poly(lactic acid) packaging biodegradation life cycle assessment
joy laskar

joy laskar

georgia tech, majasystems
在 majasystems.com 的电子邮件经过验证
被引用次数：17415
electrical engineering rf mmW packaging
Madhusudan K Iyengar

Madhusudan K Iyengar

Google
在 google.com 的电子邮件经过验证
被引用次数：16840
computer architecture thermal management data centers packaging energy efficiency
SUBRAMANIAN S. IYER

SUBRAMANIAN S. IYER

University of California at Los Angeles,
在 g.ucla.edu 的电子邮件经过验证
被引用次数：16389
Microelectronics System Integration Packaging neuromorphic computing
jone carter

jone carter

被引用次数：14738
packaging
Tadatomo Suga

Tadatomo Suga

Meisei University
在 gakushikai.jp 的电子邮件经过验证
被引用次数：14310
bonding packaging interface integration
L-T. Lim

LT. Lim

Department of Food Science, University of Guelph
在 uoguelph.ca 的电子邮件经过验证
被引用次数：13902
film fiber packaging food electrospinning
Rick Schifferstein

Rick Schifferstein

Associate Professor TU Delft
在 tudelft.nl 的电子邮件经过验证
被引用次数：13184
Food Design Eating behaviour Packaging Experience
Pierre Chandon

Pierre Chandon

L'Oréal Chaired Professor of Marketing, INSEAD
在 insead.edu 的电子邮件经过验证
被引用次数：12903
marketing consumer behavior nudging food packaging
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