Indranath Dutta

Indranath Dutta

Washington State University
在 wsu.edu 的电子邮件经过验证
被引用次数：4365
Interfaces Solders Microelectronics Flexible Interconnects Manufacturing
K. NARAYAN PRABHU

K. NARAYAN PRABHU

Professor, Department of Metallurgical and Materials Engineering, NITK
在 nitk.edu.in 的电子邮件经过验证
被引用次数：4123
heat transfer solders solidification quenching casting
Javaid Qazi

Javaid Qazi

KEMET Electronics
在 kemet.com 的电子邮件经过验证
被引用次数：2686
Material and Failure Analysis Capacitors Solders titanium Tantalum
Chih-Ming Chen

Chih-Ming Chen

National Chung Hsing University
在 dragon.nchu.edu.tw 的电子邮件经过验证
被引用次数：2573
Solar cells Nanostructures Solders Electrodeposition
Rupalee P. Mulay

Rupalee P. Mulay

Researcher
被引用次数：613
Materials characterization additive manufacturing solders intermetallics light metals
Nilesh Badwe

Nilesh Badwe

IIT Kanpur
在 iitk.ac.in 的电子邮件经过验证
被引用次数：419
Materials science Mechanical behavior of materials Semiconductor Packaging Solders
Shuang Liu

Shuang Liu

Ph.D, Beijing University of Technology
被引用次数：103
intermetallics coatings solders thermoelectric generators
Augustine Samuel

Augustine Samuel

National Institute of Technology Karnataka
在 nitk.edu.in 的电子邮件经过验证
被引用次数：63
Heat transfer Quenching Solders
Harishwar Kale

Harishwar Kale

Senior Engineer
在 coep.ac.in 的电子邮件经过验证
被引用次数：24
Polymer Nanocomposites Tribology Solders