Frank Niklaus

Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm …
在 kth.se 的电子邮件经过验证
被引用次数：9043
MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing
Sanghyeon Kim, S. Kim, S.-H. Kim, S. H. Kim, SH. Kim

Sanghyeon Kim, S. Kim, S.-H. Kim, SH Kim, SH. Kim

KAIST, Korea Institute of Science and Technology (KIST), imec, The University of Tokyo
在 kaist.ac.kr 的电子邮件经过验证
被引用次数：3677
III-V electron & photonic device wafer bonding Monolithic 3D MicroLED Mid-IR photonics
Paul B Fischer

Paul B Fischer

Intel Corporation
在 intel.com 的电子邮件经过验证
被引用次数：2820
Monolithic 3D integration CMP backside power wafer bonding semiconductor processing
Charles E. Hunt

Charles E. Hunt

Professor of Electrical and Computer Engineering, University of California - Davis
在 ece.ucdavis.edu 的电子邮件经过验证
被引用次数：2456
field emission luminescent materials wafer bonding vacuum microelectronics
Stephanie Essig

Stephanie Essig

University of Stuttgart
在 ipv.uni-stuttgart.de 的电子邮件经过验证
被引用次数：2199
Photovoltaics Si-based tandem solar cells carrier selective contacts wafer-bonding III-V multi-junction solar cells
YewChung Sermon Wu

YewChung Sermon Wu

NATIONAL YANG MING CHIAO TUNG UNIVERSITY
在 stanfordalumni.org 的电子邮件经过验证
被引用次数：1804
wafer bonding LED TFT
Viorel Dragoi

Viorel Dragoi

EV Group
在 aon.at 的电子邮件经过验证
被引用次数：1392
wafer bonding MEMS 3D integration wafer-level packaging
Hideki Hirano

Hideki Hirano

Tohoku University, Assoc. Professor
在 mems.mech.tohoku.ac.jp 的电子邮件经过验证
被引用次数：1344
Macrodevice Tactile sensor Wafer bonding Interface
Jae-Hoon Han

Jae-Hoon Han

Korea institute of science and technology (KIST)
在 kist.re.kr 的电子邮件经过验证
被引用次数：1199
Opto-electronic devices Si photonics MOS interface Wafer bonding III-V/IV semicondectors
Fumihiro Inoue

Fumihiro Inoue

Yokohama National University
在 ynu.ac.jp 的电子邮件经过验证
被引用次数：1195
3D Integration Chiplet Wafer bonding Hybrid bonding Grinding
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