Randall Irwin

Randall Irwin

University of California, Los Angeles
在 ucla.edu 的电子邮件经过验证
被引用次数：125
Flexible electronic packaging heterogeneous integration high speed interconnects wafer-scale systems electronics packaging
Vineeth Harish

Vineeth Harish

PhD Student, UCLA
在 g.ucla.edu 的电子邮件经过验证
被引用次数：2
Heterogeneous Integration Advanced Packaging Fine-Pitch Assembly Wafer-Scale Systems