| Conducting polymer material characterization using high frequency planar transmission line measurement YS Cho, RR Franklin Transactions on Electrical and Electronic Materials 13 (5), 237-240, 2012 | 29 | 2012 |
| Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process J Lee, S Park, J Park, YS Cho, KH Shin, D Lee International Journal of Precision Engineering and Manufacturing 16 (9 …, 2015 | 19 | 2015 |
| Development and characterization of optimum heat sink for 30 w chip on board led down-light BS Seo, KJ Lee, JK Yang, YS Cho, DH Park Transactions on electrical and electronic materials 13 (6), 292-296, 2012 | 16 | 2012 |
| Development of smart LED lighting system using multi-sensor module and bluetooth low energy technology YS Cho, J Kwon, S Choi, DH Park 2014 Eleventh Annual IEEE International Conference on Sensing, Communication …, 2014 | 15 | 2014 |
| Design and implementation of LED dimming system with intelligent sensor module YS Cho, J Kwon, HY Kim Journal of information and communication convergence engineering 11 (4), 247-252, 2013 | 10 | 2013 |
| Coplaner waveguide transition YS Cho, RR Franklin US Patent 9,502,382, 2016 | 8 | 2016 |
| Novel broadband through silicon via interconnect for three dimensional CPW transition YS Cho, RR Franklin The 40th European Microwave Conference, 113-116, 2010 | 7 | 2010 |
| Development of Ultrabroadband (DC–50 GHz) Wafer-Scale Packaging Method for Low-Profile Bump Flip-Chip Technology YS Cho, R Franklin-Drayton IEEE transactions on advanced packaging 32 (4), 788-796, 2009 | 6 | 2009 |
| Development of Digital Vacuum Pressure Sensor Using MEMS Analog Pirani Gauge YS Cho Journal of information and communication convergence engineering 15 (4), 232-236, 2017 | 5 | 2017 |
| Load Current and Temperature Measurement for Measuring the Insulation Resistance of the 6.6 kV Cable YK Park, YS Cho, KW Lee, KH Um, DH Park Journal of the Korean Institute of Electrical and Electronic Material …, 2015 | 5 | 2015 |
| Novel integration technique for flip-chip bonding circuit in wafer scale packaging YS Cho, RF Drayton 2006 IEEE Antennas and Propagation Society International Symposium, 57-60, 2006 | 5 | 2006 |
| Dielectric spectroscopy technique for detection of human respiratory syncytial virus YS Cho, TTT Tien, SJ Yeo Microwave and Optical Technology Letters 61 (11), 2565-2571, 2019 | 4 | 2019 |
| Performance enhancement of Pirani gauge on silicon-on-insulator wafer with simple fabrication process D Lee, Y Noh, S Park, M Kumar, YS Cho Sensors and Actuators A: Physical 263, 264-268, 2017 | 4 | 2017 |
| Design of LED Lighting System using Bluetooth Wireless Communcation HM Kim, WS Yang, YS Cho, DH Park Journal of the Korean Institute of Illuminating and Electrical Installation …, 2015 | 4 | 2015 |
| Miniaturization of inductive resonator for implementation of wireless power transfer technology using resonant inductive coupling YS Cho, JH Park, YS Nam, S Choi Journal of the Korea Institute of Information and Communication Engineering …, 2014 | 3 | 2014 |
| Characterization and lumped circuit model of ultra‐wideband flip‐chip transitions (DC 110 GHz) for WAFER‐scale packaging Y Seek Cho, R Franklin Drayton Microwave and Optical Technology Letters 51 (5), 1281-1285, 2009 | 3 | 2009 |
| Novel sensing technique for stem cells differentiation using dielectric spectroscopy of their proteins YS Cho, SJ Gwak Sensors 23 (5), 2397, 2023 | 2 | 2023 |
| The color temperature flexibility-typed LED lighting control system HM Kim, WS Yang, YS Cho, DH Park The Transactions of The Korean Institute of Electrical Engineers 64 (2), 284-288, 2015 | 2 | 2015 |
| Two-Way Relaying-Based Two-Hop Two-User Multiple-Input Multiple-Output System YS Cho, S Choi Journal of information and communication convergence engineering 12 (2), 67-74, 2014 | 2 | 2014 |
| A Study on Improving the Efficiency of a Heat Dissipation Design for 30 W COB LED Light Source BS Seo, KJ Lee, YS Cho, DH Park Journal of the Korean Institute of Electrical and Electronic Material …, 2013 | 2 | 2013 |
