| Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder MN Islam, YC Chan, MJ Rizvi, W Jillek Journal of Alloys and compounds 400 (1-2), 136-144, 2005 | 175 | 2005 |
| Effect of adding 1 wt% Bi into the Sn–2.8 Ag–0.5 Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging MJ Rizvi, YC Chan, C Bailey, H Lu, MN Islam Journal of Alloys and Compounds 407 (1-2), 208-214, 2006 | 113 | 2006 |
| Effects of hygrothermal stress on the failure of CFRP composites M Meng, MJ Rizvi, SM Grove, HR Le Composite Structures 133, 1024-1035, 2015 | 101 | 2015 |
| 3D FEA modelling of laminated composites in bending and their failure mechanisms M Meng, HR Le, MJ Rizvi, SM Grove Composite Structures 119, 693-708, 2015 | 85 | 2015 |
| Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder: Part II. Growth of intermetallic layer with Cu during wetting and aging MJ Rizvi, C Bailey, YC Chan, MN Islam, H Lu Journal of alloys and compounds 438 (1-2), 122-128, 2007 | 77 | 2007 |
| Multi-scale modelling of moisture diffusion coupled with stress distribution in CFRP laminated composites M Meng, MJ Rizvi, HR Le, SM Grove Composite Structures 138, 295-304, 2016 | 67 | 2016 |
| The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing MJ Rizvi, YC Chan, C Bailey, H Lu, A Sharif Soldering & Surface Mount Technology 17 (2), 40-48, 2005 | 55 | 2005 |
| Dissolution of electroless Ni metallization by lead-free solder alloys A Sharif, YC Chan, MN Islam, MJ Rizvi Journal of Alloys and Compounds 388 (1), 75-82, 2005 | 54 | 2005 |
| Moisture effects on the bending fatigue of laminated composites M Meng, H Le, S Grove, MJ Rizvi Composite Structures 154, 49-60, 2016 | 51 | 2016 |
| Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder: Part I: Wetting behavior on Cu and Ni substrates MJ Rizvi, C Bailey, YC Chan, H Lu Journal of Alloys and Compounds 438 (1-2), 116-121, 2007 | 49 | 2007 |
| Wetting and reaction of Sn-2.8 Ag-0.5 Cu-1.0 Bi solder with Cu and Ni substrates MJ Rizvi, YC Chan, C Bailey, H Lu, MN Islam, BY Wu Journal of electronic materials 34, 1115-1122, 2005 | 48 | 2005 |
| The effects of unequal compressive/tensile moduli of composites M Meng, HR Le, MJ Rizvi, SM Grove Composite Structures 126, 207-215, 2015 | 47 | 2015 |
| Effect of 9 wt.% in addition to Sn3. 5Ag0. 5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads MN Islam, YC Chan, A Sharif, MJ Rizvi Journal of alloys and compounds 396 (1-2), 217-223, 2005 | 39 | 2005 |
| Study of anisotropic conductive adhesive joint behavior under 3-point bending MJ Rizvi, YC Chan, C Bailey, H Lu Microelectronics Reliability 45 (3-4), 589-596, 2005 | 28 | 2005 |
| Modeling the diffusion of solid copper into liquid solder alloys MJ Rizvi, H Lu, C Bailey Thin Solid Films 517 (5), 1686-1689, 2009 | 27 | 2009 |
| A numerical investigation of the sealing performance and the strength of a raised face metallic bolted flange joint M Aljuboury, MJ Rizvi, S Grove, R Cullen International Journal of Pressure Vessels and Piping 189, 104255, 2021 | 18 | 2021 |
| Failure mechanisms of ACF joints under isothermal ageing MJ Rizvi, C Bailey, H Lu Microelectronics journal 39 (9), 1101-1107, 2008 | 18 | 2008 |
| Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology MJ Rizvi, H Lu, C Bailey, YC Chan, MY Lee, CH Pang Microelectronic engineering 85 (1), 238-244, 2008 | 18 | 2008 |
| A sustainable shipbreaking approach for cleaner environment and better wellbeing MJ Rizvi, MR Islam, O Adekola, ON Margaret Journal of cleaner production 270, 122522, 2020 | 15 | 2020 |
| Numerical simulation and design optimisation of an integrally-heated tool for composite manufacturing R Abdalrahman, S Grove, A Kyte, MJ Rizvi Materials & Design 64, 477-489, 2014 | 15 | 2014 |
Hua LuUniversity of Greenwich在 gre.ac.uk 的电子邮件经过验证
