| Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending L Liu, Z Chen, C Liu, Y Wu, B An Intermetallics 76, 10-17, 2016 | 51 | 2016 |
| A hybrid finite element modeling: artificial neural network approach for predicting solder joint fatigue life in wafer-level chip scale packages Z Chen, Z Zhang, F Dong, S Liu, L Liu Journal of Electronic Packaging 143 (1), 011001, 2021 | 28 | 2021 |
| Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles G Chen, L Liu, J Du, VV Silberschmidt, YC Chan, C Liu, F Wu Journal of Materials Science 51, 10077-10091, 2016 | 28 | 2016 |
| Synthesis, composition, morphology, and wettability of electroless Ni-Fe-P coatings with varying microstructures L Liu, J Peng, X Du, H Zheng, Z Chen, P Gong, Y Xiao, X Cao Thin Solid Films 706, 138080, 2020 | 24 | 2020 |
| Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology S Liu, D Zhang, J Xiong, C Chen, T Song, L Liu, S Huang Journal of Alloys and Compounds 781, 873-882, 2019 | 24 | 2019 |
| Effect of deposition temperature on phase composition, morphology and mechanical properties of plasma-sprayed Yb2Si2O7 coating J Huang, R Liu, Q Hu, Y Wang, X Guo, X Lu, M Xu, Y Tu, J Yuan, L Deng, ... Journal of the European Ceramic Society 41 (15), 7902-7909, 2021 | 22 | 2021 |
| Diffusion barrier property of electroless Ni-WP coating in high temperature Zn-5Al/Cu solder interconnects L Liu, Z Chen, Z Zhou, G Chen, F Wu, C Liu Journal of Alloys and Compounds 722, 746-752, 2017 | 22 | 2017 |
| Water vapor corrosion resistance and failure mechanism of SiCf/SiC composites completely coated with plasma sprayed tri-layer EBCs G Li, L Qin, X Cao, X Lu, Y Tu, H Zhang, J Jiang, L Deng, S Dong, L Liu, ... Ceramics International 48 (5), 7082-7092, 2022 | 21 | 2022 |
| Fabrication and characteristics of Cu@ Ag composite solder preform by electromagnetic compaction for power electronics C Tuo, Z Yao, W Liu, S Liu, L Liu, Z Chen, S Huang, C Liu, X Cao Journal of Materials Processing Technology 292, 117056, 2021 | 20 | 2021 |
| Microstructural evolution of 96.5 Sn–3Ag–0.5 Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient G Chen, L Liu, VV Silberschmidt, C Liu, F Wu, YC Chan Journal of Materials Science: Materials in Electronics 29, 5253-5263, 2018 | 18 | 2018 |
| Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves D Luo, Y Xiao, L Wang, L Liu, X Zeng, M Li Ceramics International 43 (10), 7531-7536, 2017 | 17 | 2017 |
| Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders Y Xiao, Y Zhang, K Zhao, S Li, L Wang, J Xiao, L Liu Ceramics International 43 (16), 14314-14320, 2017 | 16 | 2017 |
| Improvement on thermophysical and mechanincal properties of LaMgAl11O19 magnetoplumbite by Nd2O3 and Sc2O3 co-doping X Lu, J Yuan, M Xu, Q Hu, J Huang, L Deng, J Jiang, S Dong, L Liu, L Qin, ... Ceramics International 47 (20), 28892-28903, 2021 | 15 | 2021 |
| Effects of temperatures on microstructure evolution and deformation behavior of Fe–32Ni by in-situ EBSD L Liu, W Huang, M Ruan, Z Chen Materials Science and Engineering: A 875, 145097, 2023 | 14 | 2023 |
| Fabrication and microwave absorbing property of WO3@ WC with a core-shell porous structure L Liu, D Han, L Shi, Z Luo, R Shi, J Gao, Y Shi, X Cao, Z Chen Ceramics International 48 (18), 26575-26584, 2022 | 13 | 2022 |
| Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects L Liu, H Zhang, H Zheng, J Peng, P Gong, X Wang, Z Chen, X Cao Journal of Alloys and Compounds 804, 42-48, 2019 | 11 | 2019 |
| Effects of Ag on the microstructure and shear strength of rapidly solidified Sn–58Bi solder S Liu, T Song, W Xiong, L Liu, Z Liu, S Huang Journal of Materials Science: Materials in Electronics 30, 6701-6707, 2019 | 10 | 2019 |
| Effects of Ag shell on electrical, thermal and mechanical properties of Cu@ Ag composite solder preforms by electromagnetic compaction for power electronics L Liu, R Shi, S Zhang, W Liu, S Huang, Z Chen Materials Characterization 197, 112702, 2023 | 9 | 2023 |
| Deformation measurement in Al thin films at elevated temperatures by digital image correlation with speckles prepared by femtosecond laser Z Chen, G Xu, Q Cao, M Ruan, S Liu, H Pan, L Liu Optics & Laser Technology 155, 108339, 2022 | 9 | 2022 |
| Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing Z Chen, C Liu, B An, Y Wu, L Liu Journal of Materials Science: Materials in Electronics 28, 17461-17467, 2017 | 9 | 2017 |
