| Parasitic capacitive couplings in medium voltage power electronic systems: An overview BF Kjærsgaard, G Liu, MR Nielsen, R Wang, DN Dalal, TS Aunsborg, ... IEEE Transactions on Power Electronics 38 (8), 9793-9817, 2023 | 24 | 2023 |
| Development of a current source resonant inverter for high current MHz induction heating TS Aunsborg, SB Duun, S Munk‐Nielsen, C Uhrenfeldt IET power electronics 15 (1), 1-10, 2022 | 15 | 2022 |
| High‐frequency resonant operation of an integrated medium‐voltage SiC MOSFET power module AB Jørgensen, TS Aunsborg, S Bęczkowski, C Uhrenfeldt, ... IET Power Electronics 13 (3), 475-482, 2020 | 12 | 2020 |
| Digital design demonstration of 10kV SiC-MOSFET power module to improve wire-bonding layout for power cycle capabilities M Takahashi, TS Aunsborg, C Uhrenfeldt, S Munk-Nielsen, AB Jørgensen 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP), 1-6, 2022 | 6 | 2022 |
| Challenges and opportunities in the utilization of WBG devices for efficient MHz power generation TS Aunsborg, SB Duun, C Uhrenfeldt, S Munk-Nielsen IECON 2019-45th Annual Conference of the IEEE Industrial Electronics Society …, 2019 | 6 | 2019 |
| Structural characterization of movpe grown algan/gan for hemt formation VN Popok, TS Aunsborg, RH Godiksen, PK Kristensen, RR Juluri, ... Reviews on Advanced Materials Science 57 (1), 72-81, 2018 | 6 | 2018 |
| Analysis of Miller Region Sustained Oscillations during Turn-on of High-Side 10kV SiC MOSFET BF Kjærsgaard, AB Jørgensen, TS Aunsborg, JK Jørgensen, G Liu, ... 2023 25th European Conference on Power Electronics and Applications (EPE'23 …, 2023 | 5 | 2023 |
| Two-photon photoluminescence and second-harmonic generation from unintentionally doped and semi-insulating GaN crystals RH Godiksen, TS Aunsborg, PK Kristensen, K Pedersen Applied Physics B 123, 1-7, 2017 | 5 | 2017 |
| Ceramic baseplate-less 10 kV SiC MOSFET power module with integrated liquid cooling AB Jørgensen, S Beczkowski, BF Kjærsgaard, TS Aunsborg, ... 2023 25th European Conference on Power Electronics and Applications (EPE'23 …, 2023 | 4 | 2023 |
| Loss imbalance in SiC half-bridge power module BF Kjærsgaard, TS Aunsborg, JK Jørgensen, DN Dalal, M Takahashi, ... 2023 IEEE 6th International Electrical and Energy Conference (CIEEC), 3247-3253, 2023 | 3 | 2023 |
| Analysis of nonlinear conductivity coating used to improve electric field distribution in medium voltage power module Y Gao, Y Yang, H Zhao, TS Aunsborg, S Munk-Nielsen, C Uhrenfeldt 2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022 | 3 | 2022 |
| Class-e push-pull resonance converter with load variation robustness for industrial induction heating JD Meinert, BF Kjærsgaard, TS Aunsborg, AB Jorgensen, S Munk-Nielsen, ... 2022 24th European Conference on Power Electronics and Applications (EPE'22 …, 2022 | 3 | 2022 |
| Discovery of Loss Imbalance in SiC Half-Bridge Power Modules–Analysis and Validations BF Kjærsgaard, G Liu, TS Aunsborg, DN Dalal, JK Jørgensen, ... IEEE Transactions on Power Electronics, 2024 | 2 | 2024 |
| Demonstration of a Class E push-pull resonant inverter for MHz induction heating TS Aunsborg, B Bidoggia, SB Duun, BF Kjærsgaard, JD Meinert, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 705-709, 2023 | 2 | 2023 |
| Methods for increasing the Partial Discharge Inception Voltage of Power Module Substrates using Guard Ring Structures Y Gao, C Uhrenfeldt, S Munk-Nielsen, TS Aunsborg 2024 IEEE Applied Power Electronics Conference and Exposition (APEC), 2568-2573, 2024 | 1 | 2024 |
| Calorimetric measurement methodology for comprehensive soft and hard switching loss characterisation S Bęczkowski, M Zäch, F Ahmad, TS Aunsborg, S Munk-Nielsen 2023 IEEE Energy Conversion Congress and Exposition (ECCE), 5789-5793, 2023 | 1 | 2023 |
| Thermal Performance of an Integrated Heat Spreader for GaN HEMT devices F Ahmad, TS Aunsborg, SM Beczkowski, S Munk-Nielsen, AB Jorgensen CIPS 2022; 12th International Conference on Integrated Power Electronics …, 2022 | 1 | 2022 |
| Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules Y Gao, K Yin, CL Bak, AB Jørgensen, Z Zhang, H Zhao, S Munk-Nielsen, ... IEEE Transactions on Power Electronics, 2024 | | 2024 |
| Demonstration of 7.2 kV/200 A Switching Performance for a 10 kV SiC MOSFET Half-bridge Power Module G Liu, Z Yan, JK Jørgensen, MR Nielsen, BF Kjærsgaard, N Qi, ... 2024 IEEE 11th Workshop on Wide Bandgap Power Devices & Applications (WiPDA …, 2024 | | 2024 |
| Late News: Liquid Metal Interconnects for SiC MOSFETs N Baker, F Iannuzzo, S Bęczkowski, K Pedersen, TS Aunsborg, R Garcia, ... Scientific Books of Abstracts 8, 139-140, 2024 | | 2024 |
