| Nickel Cobalt Sulfide core/shell structure on 3D Graphene for supercapacitor application LG Beka, X Li, W Liu Scientific reports 7 (1), 2105, 2017 | 122 | 2017 |
| Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen Materials Letters 128, 42-45, 2014 | 122 | 2014 |
| A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air J Li, X Li, L Wang, YH Mei, GQ Lu Materials & Design 140, 64-72, 2018 | 80 | 2018 |
| Creep properties of low-temperature sintered nano-silver lap shear joints X Li, G Chen, L Wang, YH Mei, X Chen, GQ Lu Materials Science and Engineering: A 579, 108-113, 2013 | 80 | 2013 |
| Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear joint G Chen, ZS Zhang, YH Mei, X Li, DJ Yu, L Wang, X Chen Mechanics of Materials 72, 61-71, 2014 | 70 | 2014 |
| Temperature Dependence of Dynamic Performance Characterization of 1.2-kV SiC Power mosfets Compared With Si IGBTs for Wide Temperature Applications J Qi, X Yang, X Li, K Tian, Z Mao, S Yang, W Song IEEE Transactions on Power Electronics 34 (9), 9105-9117, 2018 | 62 | 2018 |
| Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates Q Xu, Y Mei, X Li, GQ Lu Journal of Alloys and Compounds 675, 317-324, 2016 | 61 | 2016 |
| Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate SY Zhao, X Li, YH Mei, GQ Lu Microelectronics Reliability 55 (12), 2524-2531, 2015 | 61 | 2015 |
| Simplification of low-temperature sintering nanosilver for power electronics packaging Y Mei, G Chen, Y Cao, X Li, D Han, X Chen Journal of electronic materials 42, 1209-1218, 2013 | 59 | 2013 |
| Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications X Wang, Y Mei, X Li, M Wang, Z Cui, GQ Lu Journal of Alloys and Compounds 777, 578-585, 2019 | 51 | 2019 |
| Reliability evaluation of multichip phase-leg IGBT modules using pressureless sintering of nanosilver paste by power cycling tests S Fu, Y Mei, X Li, C Ma, GQ Lu IEEE Transactions on Power Electronics 32 (8), 6049-6058, 2016 | 51 | 2016 |
| Granular activated carbon supported iron as a heterogeneous persulfate catalyst for the pretreatment of mature landfill leachate Z Li, Q Yang, Y Zhong, X Li, L Zhou, X Li, G Zeng RSC advances 6 (2), 987-994, 2016 | 50 | 2016 |
| Reliability improvement of a double-sided IGBT module by lowering stress gradient using molybdenum buffers M Wang, Y Mei, W Liu, Y Xie, S Fu, X Li, GQ Lu IEEE Journal of Emerging and Selected Topics in Power Electronics 7 (3 …, 2019 | 49 | 2019 |
| Fatigue and dwell-fatigue behavior of nano-silver sintered lap-shear joint at elevated temperature Y Tan, X Li, X Chen Microelectronics Reliability 54 (3), 648-653, 2014 | 49 | 2014 |
| Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 mm2) Power Chips at Low Temperatures for Electronic Packaging S Fu, Y Mei, X Li, P Ning, GQ Lu Journal of Electronic Materials 44, 3973-3984, 2015 | 45 | 2015 |
| Rapid sintering of nano-Ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging Y Xie, Y Wang, Y Mei, H Xie, K Zhang, S Feng, KS Siow, X Li, GQ Lu Journal of Materials Processing Technology 255, 644-649, 2018 | 44 | 2018 |
| Rapid sintering nanosilver joint by pulse current for power electronics packaging Y Mei, Y Cao, G Chen, X Li, GQ Lu, X Chen IEEE Transactions on Device and Materials Reliability 13 (1), 258-265, 2013 | 44 | 2013 |
| Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging G Chen, L Yu, YH Mei, X Li, X Chen, GQ Lu Journal of Materials Processing Technology 214 (9), 1900-1908, 2014 | 41 | 2014 |
| High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei Microelectronics Reliability 53 (1), 174-181, 2013 | 41 | 2013 |
| Mechanical property evaluation of nano‐silver paste sintered joint using lap‐shear test X Li, G Chen, X Chen, GQ Lu, L Wang, YH Mei Soldering & surface mount technology 24 (2), 120-126, 2012 | 41 | 2012 |
GQ Lu or Guo-Quan Lu or G-Q LuVirginia Tech ECE and MSE在 vt.edu 的电子邮件经过验证
