| Room-temperature spin-orbit torque from topological surface states H Wu, P Zhang, P Deng, Q Lan, Q Pan, SA Razavi, X Che, L Huang, B Dai, ... Physical review letters 123 (20), 207205, 2019 | 169 | 2019 |
| Role of dimensional crossover on spin-orbit torque efficiency in magnetic insulator thin films Q Shao, C Tang, G Yu, A Navabi, H Wu, C He, J Li, P Upadhyaya, ... Nature communications 9 (1), 3612, 2018 | 114 | 2018 |
| Magnetic memory driven by topological insulators H Wu, A Chen, P Zhang, H He, J Nance, C Guo, J Sasaki, T Shirokura, ... Nature communications 12 (1), 6251, 2021 | 85 | 2021 |
| Probing the low-temperature limit of the quantum anomalous Hall effect L Pan, X Liu, QL He, A Stern, G Yin, X Che, Q Shao, P Zhang, P Deng, ... Science advances 6 (25), eaaz3595, 2020 | 47 | 2020 |
| Ferrimagnetic skyrmions in topological insulator/ferrimagnet heterostructures H Wu, F Groß, B Dai, D Lujan, SA Razavi, P Zhang, Y Liu, K Sobotkiewich, ... Advanced Materials 32 (34), 2003380, 2020 | 46 | 2020 |
| Strongly surface state carrier‐dependent spin–orbit torque in magnetic topological insulators X Che, Q Pan, B Vareskic, J Zou, L Pan, P Zhang, G Yin, H Wu, Q Shao, ... Advanced Materials 32 (16), 1907661, 2020 | 41 | 2020 |
| Effect of electron concentration on electrical conductivity in in situ Al-TiB2 nanocomposites S Pan, J Yuan, P Zhang, M Sokoluk, G Yao, X Li Applied Physics Letters 116 (1), 2020 | 38 | 2020 |
| Distinguishing the two-component anomalous hall effect from the topological Hall effect L Tai, B Dai, J Li, H Huang, SK Chong, KL Wong, H Zhang, P Zhang, ... ACS nano 16 (10), 17336-17346, 2022 | 34 | 2022 |
| Observation of quantum anomalous Hall effect and exchange interaction in topological insulator/antiferromagnet heterostructure L Pan, A Grutter, P Zhang, X Che, T Nozaki, A Stern, M Street, B Zhang, ... Advanced Materials 32 (34), 2001460, 2020 | 34 | 2020 |
| Room temperature highly efficient topological insulator/Mo/CoFeB spin-orbit torque memory with perpendicular magnetic anisotropy Q Shao, H Wu, Q Pan, P Zhang, L Pan, K Wong, X Che, KL Wang 2018 IEEE International Electron Devices Meeting (IEDM), 36.3. 1-36.3. 4, 2018 | 28 | 2018 |
| Electrothermal effects on hot carrier injection in n-type SOI FinFET under circuit-speed bias P Zhang, W Chen, J Hu, WY Yin IEEE Transactions on Electron Devices 64 (9), 3802-3807, 2017 | 22 | 2017 |
| Bulk dissipation in the quantum anomalous Hall effect LK Rodenbach, IT Rosen, EJ Fox, P Zhang, L Pan, KL Wang, MA Kastner, ... APL Materials 9 (8), 2021 | 20 | 2021 |
| Mesoscopic transport of quantum anomalous Hall effect in the submicron size regime G Qiu, P Zhang, P Deng, SK Chong, L Tai, C Eckberg, KL Wang Physical review letters 128 (21), 217704, 2022 | 18 | 2022 |
| Measured potential profile in a quantum anomalous Hall system suggests bulk-dominated current flow IT Rosen, MP Andersen, LK Rodenbach, L Tai, P Zhang, KL Wang, ... Physical review letters 129 (24), 246602, 2022 | 15 | 2022 |
| Efficient Spin‐Orbit Torque Switching of Perpendicular Magnetization using Topological Insulators with High Thermal Tolerance Q Pan, Y Liu, H Wu, P Zhang, H Huang, C Eckberg, X Che, Y Wu, B Dai, ... Advanced Electronic Materials 8 (9), 2200003, 2022 | 15 | 2022 |
| Large spin to charge conversion in antiferromagnetic Weyl semimetal Mn3Sn T Yu, H Wu, H He, C Guo, C Fang, P Zhang, KL Wong, S Xu, X Han, ... APL Materials 9 (4), 2021 | 15 | 2021 |
| Low‐Power and Field‐Free Perpendicular Magnetic Memory Driven by Topological Insulators B Cui, A Chen, X Zhang, B Fang, Z Zeng, P Zhang, J Zhang, W He, G Yu, ... Advanced Materials 35 (31), 2302350, 2023 | 13 | 2023 |
| Metrological assessment of quantum anomalous Hall properties LK Rodenbach, AR Panna, SU Payagala, IT Rosen, MP Andersen, ... Physical Review Applied 18 (3), 034008, 2022 | 13 | 2022 |
| Fractional AC Josephson effect in a topological insulator proximitized by a self-formed superconductor IT Rosen, CJ Trimble, MP Andersen, E Mikheev, Y Li, Y Liu, L Tai, ... arXiv preprint arXiv:2110.01039, 2021 | 11 | 2021 |
| Demonstration of superconducting interconnects on the silicon interconnect fabric using thermocompression bonding YT Yang, C Hu, J Green, P Zhang, N Shakoorzadeh, P Ambhore, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1861-1866, 2020 | 7 | 2020 |
Peng DengBeijing Academy of Quantum Information Sciences在 baqis.ac.cn 的电子邮件经过验证
