| Influence of processing parameters of selective laser melting on high‐cycle and very‐high‐cycle fatigue behaviour of Ti‐6Al‐4V L Du, G Qian, L Zheng, Y Hong Fatigue & Fracture of Engineering Materials & Structures 44 (1), 240-256, 2021 | 70 | 2021 |
| Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method X Long, K Chong, Y Su, L Du, G Zhang Engineering Fracture Mechanics 281, 109137, 2023 | 59 | 2023 |
| Crack initiation mechanisms under two stress ratios up to very-high-cycle fatigue regime for a selective laser melted Ti-6Al-4V L Du, X Pan, G Qian, L Zheng, Y Hong International Journal of Fatigue 149, 106294, 2021 | 48 | 2021 |
| Effects of inclusion size and stress ratio on the very-high-cycle fatigue behavior of pearlitic steel T Cong, G Qian, G Zhang, S Wu, X Pan, L Du, X Liu International Journal of Fatigue 142, 105958, 2021 | 25 | 2021 |
| Microstructure features induced by fatigue crack initiation up to very-high-cycle regime for an additively manufactured aluminium alloy X Pan, L Du, G Qian, Y Hong Journal of Materials Science & Technology 173, 247-260, 2024 | 9 | 2024 |
| High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: insights from constitutive and multi-scale modelling D Hu, C Qian, X Liu, L Du, Z Sun, X Fan, G Zhang, J Fan journal of materials research and technology 26, 3183-3200, 2023 | 7 | 2023 |
| New insights into microstructure refinement in crack initiation region of very-high-cycle fatigue for SLM Ti-6Al-4V via precession electron diffraction L Du, X Pan, Y Hong Materialia 33, 102008, 2024 | 3 | 2024 |
| Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration X Ji, L Du, S He, H van Zeijl, G Zhang Microelectronics Reliability 150, 115180, 2023 | 3 | 2023 |
| Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices L Du, D Hu, R Poelm, W Van Driel, K Zhang 2023 24th International Conference on Thermal, Mechanical and Multi-Physics …, 2023 | 2 | 2023 |
| Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects L Du, X Zhao, P Watté, R Poelma, W Van Driel, G Zhang IECON 2022–48th Annual Conference of the IEEE Industrial Electronics Society …, 2022 | 2 | 2022 |
| Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures J Mo, GJK Schaffar, L Du, V Maier-Kiener, D Kiener, S Vollebregt, ... 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems …, 2024 | 1 | 2024 |
| High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material L Du, X Zhao, R Poelma, W Van Driel, G Zhang 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 392-395, 2023 | 1 | 2023 |
| Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films X Ji, H Van Zeijl, W Jiao, S He, L Du, G Zhang 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1237-1243, 2023 | 1 | 2023 |
| Evaluating the electromigration effect on mechanical performance degradation of aluminum interconnection wires: A nanoindentation test with molecular dynamics simulation study S Feng, L Du, Z Cui, X Zhu, X Fan, G Zhang, J Fan Applied Surface Science 676, 160992, 2024 | | 2024 |
| Research Viewpoint on Performance Enhancement for Very-High-Cycle Fatigue of Ti-6Al-4V Alloys via Laser-Based Powder Bed Fusion C Gao, Y Zhang, J Jiang, R Fu, L Du, X Pan Crystals 14 (9), 749, 2024 | | 2024 |
| A Literature Survey on Performance Enhancement for Very-High-Cycle Fatigue of Additively Manufactured Titanium Alloys C Gao, Y Zhang, JJ Jiang, R Fu, L Du, X Pan Preprints, 2024 | | 2024 |
| Health Monitoring Fatigue Properties of Solder Interconnects in LED Drivers L Du, X Zhao, RH Poelma, WD van Driel, GQ Zhang Recent Advances in Microelectronics Reliability: Contributions from the …, 2024 | | 2024 |
| 20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering X Ji, L Du, H Van Zeijl, G Zhang, J Derakhshandeh, E Beyne 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1891-1895, 2024 | | 2024 |
| Multi-parameters optimization for electromigration in WLCSP solder bumps L Du, S Deng, Z Cui, R Poelma, C Beelen-Hendrikx, K Zhang 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | | 2024 |
| Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging D Hu, L Du, M Alfreider, J Fan, D Kiener, G Zhang Materials Science and Engineering: A 897, 146316, 2024 | | 2024 |
Xiangnan PANInstitute of Mechanics, Chinese Academy of Sciences在 lnm.imech.ac.cn 的电子邮件经过验证
Xiangnan PANInstitute of Mechanics, Chinese Academy of Sciences在 lnm.imech.ac.cn 的电子邮件经过验证