关注
Massinissa Nabet
Massinissa Nabet
在 uclouvain.be 的电子邮件经过验证
标题
引用次数
引用次数
年份
Post-process porous silicon for 5G applications
G Scheen, R Tuyaerts, M Rack, L Nyssens, J Rasson, M Nabet, JP Raskin
Solid-State Electronics 168, 107719, 2020
212020
Behavior of gold-doped silicon substrate under small-and large-RF signal
M Nabet, M Rack, NZI Hashim, CHK de Groot, JP Raskin
Solid-State Electronics 168, 107718, 2020
72020
Double buried oxide trap-rich substrates for high frequency applications
M Nabet, M Rack, Y Yan, BY Nguyen, JP Raskin
IEEE Electron Device Letters 44 (4), 570-573, 2023
62023
High-resistivity substrates with PN interface passivation in 22 nm FD-SOI
M Rack, L Nyssens, M Nabet, C Schwan, Z Zhao, S Lehmann, ...
2022 International Symposium on VLSI Technology, Systems and Applications …, 2022
62022
28 GHz Down-Conversion Mixer with RF Back-Gate Excitation Topology in 22-nm FD-SOI
M Nabet, M Rack, L Nyssens, JP Raskin, D Lederer
2022 17th European Microwave Integrated Circuits Conference (EuMIC), 296-299, 2022
52022
PN junctions interface passivation in 22 nm FDSOI for low-loss passives
L Nyssens, M Rack, M Nabet, C Schwan, Z Zhao, S Lehmann, ...
2022 24th International Microwave and Radar Conference (MIKON), 1-4, 2022
42022
CV measurement and modeling of double-BOX Trap-Rich SOI substrate
Y Huang, Y Yan, M Nabet, F Liu, B Li, B Li, Z Han, BY Nguyen, ...
Solid-State Electronics 209, 108763, 2023
32023
High-resistivity with PN interface passivation in 22 nm FD-SOI technology for low-loss passives at RF and millimeter-wave frequencies
L Nyssens, M Rack, M Nabet, C Schwan, Z Zhao, S Lehmann, ...
Solid-State Electronics 205, 108656, 2023
32023
Development Of High Resistivity FD-SOI Substrates for mmWave Applications
I Bertrand, P Flatresse, G Besnard, JM Bethoux, Z Chalupa, C Plantier, ...
ECS Transactions 108 (5), 31, 2022
32022
Nox and Buried PN junctions effect on RF performance of High-Resistivity Silicon substrates
M Moulin, M Rack, T Fache, M Nabet, Z Chalupa, C Plantier, F Allibert, ...
2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in …, 2022
22022
Impact of a High-resistivity Substrate on RF and mm-wave Performance of 22 nm FD-SOI Devices and Circuits
M Rack, L Nyssens, M Nabet, D Lederer, JP Raskin
Technologies Enabling Future Mobile Connectivity & Sensing, 127-142, 2023
12023
High-Temperature Characterization of Novel Silicon-Based Substrate Solutions for RF-IC Applications
Q Courte, M Rack, M Nabet, P Cardinael, JP Raskin
ESSDERC 2021-IEEE 51st European Solid-State Device Research Conference …, 2021
12021
Field-Effect Passivation of Lossy Interfaces in High-Resistivity RF Silicon Substrates
M Rack, L Nyssens, M Nabet, D Lederer, JP Raskin
2021 Joint International EUROSOI Workshop and International Conference on …, 2021
12021
Analysis of Back-Gate Bias Control on EVM Measurements of a Dual-Band Power Amplifier in 22 nm FD-SOI for 5G 28 and 39 GHz Applications
L Nyssens, M Nabet, M Rack, Y Bendou, S Wane, JB Sombrin, JP Raskin, ...
IEEE Transactions on Circuits and Systems I: Regular Papers, 2024
2024
Sub-6 GHz RF SPDT Switches Designed in an Advanced 28 nm Fully-Depleted Silicon-on-Insulator Technology with a High Resistivity Substrate
M Nabet, M Rack, S Crémer, F Paillardet, A Cathelin, JP Raskin, ...
2024 19th European Microwave Integrated Circuits Conference (EuMIC), 455-458, 2024
2024
CV characterization of the trap-rich layer in a novel Double-BOX structure
Y Huang, F Liu, S Cristoloveanu, S Ma, M Nabet, Y Yan, B Li, B Li, ...
Solid-State Electronics 218, 108951, 2024
2024
Analysis of anomalous CV behavior for extracting the traps density in the undoped polysilicon with a double-BOX structure
Y Huang, Y Yan, M Nabet, F Liu, B Li, B Li, Z Han, S Cristoloveanu, ...
Solid-State Electronics 217, 108946, 2024
2024
Towards Porous SI THz Planar Waveguides in Ultra-Low-Resistivity Substrates
S Ma, M Nabet, R Hanus, JP Raskin, LA Francis, D Lederer
2024 15th Global Symposium on Millimeter-Waves & Terahertz (GSMM), 225-227, 2024
2024
Impact of a High-resistivity
M Rack, L Nyssens, M Nabet, D Lederer, JP Raskin
Technologies Enabling Future Mobile Connectivity & Sensing, 127, 2024
2024
GaN-on-Porous Silicon for RF Applications
G Scheen, R Tuyaerts, P Cardinael, E Ekoga, K Aouadi, C Pavageau, ...
2023 53rd European Microwave Conference (EuMC), 842-845, 2023
2023
系统目前无法执行此操作,请稍后再试。
文章 1–20