Anisotropic thermal conductivity of exfoliated black phosphorus H Jang, JD Wood, CR Ryder, MC Hersam, DG Cahill Advanced materials 27 (48), 8017-8022, 2015 | 274 | 2015 |
Direct Synthesis of Large‐Scale WTe2 Thin Films with Low Thermal Conductivity Y Zhou, H Jang, JM Woods, Y Xie, P Kumaravadivel, GA Pan, J Liu, Y Liu, ... Advanced Functional Materials 27 (8), 1605928, 2017 | 111 | 2017 |
3D anisotropic thermal conductivity of exfoliated rhenium disulfide H Jang, CR Ryder, JD Wood, MC Hersam, DG Cahill Advanced Materials 29 (35), 1700650, 2017 | 106 | 2017 |
Solution-Processed Cu2Se Nanocrystal Films with Bulk-Like Thermoelectric Performance JD Forster, JJ Lynch, NE Coates, J Liu, H Jang, E Zaia, MP Gordon, ... Scientific reports 7 (1), 2765, 2017 | 36 | 2017 |
Ultralow thermal conductivity of turbostratically disordered MoSe2 ultra-thin films and implications for heterostructures EC Hadland, H Jang, N Wolff, R Fischer, AC Lygo, G Mitchson, D Li, ... Nanotechnology 30 (28), 285401, 2019 | 29 | 2019 |
RKKY Exchange Bias Mediated Ultrafast All‐Optical Switching of a Ferromagnet J Chatterjee, D Polley, A Pattabi, H Jang, S Salahuddin, J Bokor Advanced Functional Materials 32 (8), 2107490, 2022 | 22 | 2022 |
Nonequilibrium heat transport in Pt and Ru probed by an ultrathin Co thermometer H Jang, J Kimling, DG Cahill Physical Review B 101 (6), 064304, 2020 | 20 | 2020 |
Defect structure and Fermi-level pinning of BaTiO 3 co-doped with a variable-valence acceptor (Mn) and a fixed-valence donor (Y) YY Yeoh, H Jang, HI Yoo Physical Chemistry Chemical Physics 14 (5), 1642-1648, 2012 | 20 | 2012 |
Synthesis, Characterization, and Ultralow Thermal Conductivity of a Lattice-Mismatched SnSe2(MoSe2)1.32 Heterostructure E Hadland, H Jang, M Falmbigl, R Fischer, DL Medlin, DG Cahill, ... Chemistry of Materials 31 (15), 5699-5705, 2019 | 18 | 2019 |
Ultralow Thermal Conductivity in Nanoporous Crystalline Fe3O4 JG Kang, H Jang, J Ma, Q Yang, K Hattar, Z Diao, R Yuan, J Zuo, S Sinha, ... The Journal of Physical Chemistry C 125 (12), 6897-6908, 2021 | 16 | 2021 |
Thermal Conductivity of Oxide Tunnel Barriers in Magnetic Tunnel Junctions Measured by Ultrafast Thermoreflectance and Magneto-Optic Kerr Effect Thermometry H Jang, L Marnitz, T Huebner, J Kimling, T Kuschel, DG Cahill Physical Review Applied 13 (2), 024007, 2020 | 16 | 2020 |
Thermochromic properties of ZnO/VO2/ZnO films on soda lime silicate glass deposited by RF magnetron sputtering W Jin, K Park, JY Cho, SH Bae, M Siyar, H Jang, C Park Ceramics International 49 (7), 10437-10444, 2023 | 12 | 2023 |
Thermal transport properties of phonons in halide perovskites Y Jung, W Lee, S Han, BS Kim, SJ Yoo, H Jang Advanced Materials 35 (43), 2204872, 2023 | 8 | 2023 |
Unexpected thermoelectric behavior and immiscibility of the allegedly complete solid solution H Jang, J Brendt, LN Patro, M Martin, HI Yoo Physical Review B 89 (14), 144107, 2014 | 8 | 2014 |
Thermo-Mechanical Challenges of 2.5 D Packaging: A Review of Warpage and Interconnect Reliability H Kim, JY Hwang, SE Kim, YC Joo, H Jang IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 6 | 2023 |
Review on thermal transport and lattice dynamics of high-entropy alloys containing Ni B Kang, S Lee, W Lee, KN Yoon, ES Park, H Jang Current Opinion in Solid State and Materials Science 29, 101146, 2024 | 2 | 2024 |
Ecofriendly Transfer Printing for Biodegradable Electronics Using Adhesion Controllable Self‐Assembled Monolayers SM Lee, WJ Lee, JY Bae, JW Gu, S Lee, KB Yeo, J Lee, JW Kim, JY Lee, ... Advanced Functional Materials 34 (6), 2310612, 2024 | 2 | 2024 |
Analysis of ultrafast magnetization switching dynamics in exchange-coupled ferromagnet–ferrimagnet heterostructures D Polley, J Chatterjee, H Jang, J Bokor Journal of Magnetism and Magnetic Materials 574, 170680, 2023 | 2 | 2023 |
Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films JY Hwang, D Kim, H Jang, SY Lee, YC Joo Electronic Materials Letters, 1-9, 2024 | | 2024 |
Thermal Transport Properties of Hybrid Bonding With Passivation H Kim, JY Hwang, S Park, SE Kim, YC Joo, H Jang 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1609-1612, 2024 | | 2024 |