| Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics Y Farraj, M Grouchko, S Magdassi Chemical Communications 51 (9), 1587-1590, 2015 | 182 | 2015 |
| Plasma-induced decomposition of copper complex ink for the formation of highly conductive copper tracks on heat-sensitive substrates Y Farraj, A Smooha, A Kamyshny, S Magdassi ACS applied materials & interfaces 9 (10), 8766-8773, 2017 | 75 | 2017 |
| Air stable copper-silver core-shell submicron particles: Synthesis and conductive ink formulation A Pajor-Świerzy, Y Farraj, A Kamyshny, S Magdassi Colloids and Surfaces A: Physicochemical and Engineering Aspects 521, 272-280, 2017 | 44 | 2017 |
| Effect of carboxylic acids on conductivity of metallic films formed by inks based on copper@ silver core-shell particles A Pajor-Świerzy, Y Farraj, A Kamyshny, S Magdassi Colloids and Surfaces A: Physicochemical and Engineering Aspects 522, 320-327, 2017 | 30 | 2017 |
| Binuclear copper complex ink as a seed for electroless copper plating yielding> 70% bulk conductivity on 3D printed polymers Y Farraj, M Layani, A Yaverboim, S Magdassi Advanced Materials Interfaces 5 (8), 1701285, 2018 | 24 | 2018 |
| Inkjet printing and rapid ebeam sintering enable formation of highly conductive patterns in roll to roll process Y Farraj, M Bielmann, S Magdassi RSC advances 7 (25), 15463-15467, 2017 | 14 | 2017 |
| Fabrication Approaches of Soft Electronics JMR Tan, Y Farraj, A Kamyshny, S Magdassi ACS Applied Electronic Materials 5 (3), 1376-1393, 2023 | 12 | 2023 |
| E-textile by printing an all-through penetrating copper complex ink Y Farraj, A Kanner, S Magdassi ACS Applied Materials & Interfaces 15 (17), 21651-21658, 2023 | 11 | 2023 |
| Device and method for determination of pupil size in a subject having closed eyelids J Cohen, V Goldman, YN Farraj, A Buxboim, Y Mintz, E Fried, L Gahl, ... US Patent 11,122,972, 2021 | 5 | 2021 |
| Ink-jet printed copper complex MOD ink for plastic electronics Y Farraj, M Grouchko, S Magdassi, F Koch, M Wittkötter, M Müller, ... NIP & Digital Fabrication Conference 30, 191-193, 2014 | 4 | 2014 |
| Measuring pupil size and light response through closed eyelids Y Farraj, A Buxboim, JE Cohen, Y Kan-Tor, SG Hagege, D Weiss, ... Biomedical Optics Express 12 (10), 6485-6495, 2021 | 2 | 2021 |
| Device and method for determination of pupil size in a subject having closed eyelids J Cohen, V Goldman, YN Farraj, A Buxboim, Y Mintz, E Fried, L Gahl, ... US Patent 11,684,255, 2023 | | 2023 |
| A novel approach to RFI shielding for electro-optical systems by using metallic grids Y Farraj, S Joseph, Y Weber, S Mgdassi Optical Interference Coatings, FB. 6, 2022 | | 2022 |
| Electroless Plating with Copper Complex Ink as a Seed KH Chew, Y Farraj, S Magdassi 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 36-40, 2020 | | 2020 |
| 3D Printings: Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding> 70% Bulk Conductivity on 3D Printed Polymers (Adv. Mater. Interfaces 8/2018) Y Farraj, M Layani, A Yaverboim, S Magdassi Advanced Materials Interfaces 5 (8), 1870038, 2018 | | 2018 |
| Effect of carboxylic acids on conductivity of metallic films formed by inks based on copperver core-shell particles A Kamyshny, S Magdassi, Y Farraj Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2017 | | 2017 |
Ingo ReinholdLeipzig University of Applied Sciences在 kth.se 的电子邮件经过验证
Ingo ReinholdLeipzig University of Applied Sciences在 kth.se 的电子邮件经过验证