| Flux effect on void quantity and size in soldered joints D Bušek, K Dušek, D Růžička, M Plaček, P Mach, J Urbánek, J Starý Microelectronics Reliability 60, 135-140, 2016 | 76 | 2016 |
| Solder joint quality evaluation based on heating factor P Veselý, E Horynová, J Starý, D Bušek, K Dušek, V Zahradník, M Plaček, ... Circuit World 44 (1), 37-44, 2018 | 39 | 2018 |
| Analysis of no-clean flux spatter during the soldering process P Veselý, D Bušek, O Krammer, K Dušek Journal of materials processing technology 275, 116289, 2020 | 34 | 2020 |
| Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, O Krammer, D Bušek International Journal of heat and mass transfer 114, 613-620, 2017 | 28 | 2017 |
| Effects of substrate thermal properties on the heat transfer coefficient of vapour phase soldering B Illés, A Géczy, A Skwarek, D Busek International Journal of Heat and Mass Transfer 101, 69-75, 2016 | 28 | 2016 |
| Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis K Dušek, D Bušek Microelectronics Reliability 56, 162-169, 2016 | 25 | 2016 |
| The effect of solder paste particle size on the thixotropic behaviour during stencil printing O Krammer, B Gyarmati, A Szilágyi, B Illés, D Bušek, K Dušek Journal of materials processing technology 262, 571-576, 2018 | 22 | 2018 |
| The influence of the crystallographic structure of the intermetallic grains on tin whisker growth B Illés, A Skwarek, J Ratajczak, K Dušek, D Bušek Journal of Alloys and Compounds 785, 774-780, 2019 | 19 | 2019 |
| Modelling of temperature distribution along PCB thickness in different substrates during reflow D Straubinger, I Bozsóki, D Bušek, B Illés, A Géczy Circuit World 46 (2), 85-92, 2020 | 17 | 2020 |
| Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect) K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés Journal of Materials Processing Technology 251, 20-25, 2018 | 17 | 2018 |
| Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly P Mach, A Geczy, R Polanský, D Bušek Journal of Materials Science: Materials in Electronics 30, 4895-4907, 2019 | 16 | 2019 |
| Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy International Journal of Heat and Mass Transfer 184, 122268, 2022 | 15 | 2022 |
| Effect of Cu substrate roughness and Sn layer thickness on whisker development from Sn thin-films B Illés, T Hurtony, O Krammer, B Medgyes, K Dušek, D Bušek Materials 12 (21), 3609, 2019 | 14 | 2019 |
| Effect of the vapour concentration decrease on the solder joints temperature in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, L Jakab, D Bušek, K Dušek Soldering & Surface Mount Technology 30 (2), 66-73, 2018 | 13 | 2018 |
| Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy B Illés, H Choi, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Research and Technology 20, 4231-4240, 2022 | 11 | 2022 |
| Kinetics of Sn whisker growth from Sn thin-films on Cu substrate B Illés, O Krammer, T Hurtony, K Dušek, D Bušek, A Skwarek Journal of Materials Science: Materials in Electronics 31, 16314-16323, 2020 | 11 | 2020 |
| Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs D Straubinger, A Geczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ... Circuit World 45 (1), 37-44, 2019 | 11 | 2019 |
| Mathematical modelling of temperature distribution in selected parts of fff printer during 3d printing process T Tichý, O Šefl, P Veselý, K Dušek, D Bušek Polymers 13 (23), 4213, 2021 | 10 | 2021 |
| Investigating the attack angle of squeegees with different geometries O Krammer, L Jakab, B Illes, D Bušek, IB Pelikánová Soldering & Surface Mount Technology 30 (2), 112-117, 2017 | 10 | 2017 |
| Correlations between mechanical and electrical parameters of modified electrically conductive adhesives D Bušek, J Šelepová, P Mach Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 10 | 2011 |
