| Enhanced infrared sensing properties of vanadium pentoxide nanofibers for bolometer application S Vadnala, N Paul, A Agrawal, SG Singh Materials Science in Semiconductor Processing 81, 82-88, 2018 | 21 | 2018 |
| Facile synthesis of electrospun nickel (II) oxide Nanofibers and its application for hydrogen peroxide sensing S Vadnala, S Tripathy, N Paul, A Agrawal, SG Singh ChemistrySelect 3 (43), 12263-12268, 2018 | 12 | 2018 |
| Achieving of intensified conductive interconnections for Flex-on-Flex by using metal passivated Copper–Copper Thermocompression bonding CH Kumar, S Bonam, N Paul, SRK Vanjari, SG Singh 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1732-1737, 2018 | 4 | 2018 |
| Fabrication and Characterization of suspended La0. 7Sr0. 3MnO3Nanofibers for high-sensitive and fast-responsive Infrared Bolometer N Paul, S vandala, S Bonam, A Agrawal, SRK Vanjari, SG Singh Journal of Micromechanics and Microengineering, 2023 | 2 | 2023 |
| Vanadium Pentoxide Nanofibers as IR sensors for Bolometer applications N Paul, S Vadnala, AK Panigrahi, CH Kumar, A Agrawal, SG Singh ECS Transactions 85 (13), 1573, 2018 | 1 | 2018 |
| Facile approach of enhanced heat mitigation between 3D stacked layers by Introducing a sub-micron thick heat spreading materials CH Kumar, AK Panigrahi, P Supraja, N Paul, SG Singh | 1 | 2017 |
| Design fabrication and characterization of uncooled microbolometer for thermal imaging applications N Paul Kandi, 2021 | | 2021 |
| Fabrication of Area Effective Silicon Membrane By Frontend Bulk Micromachining for High Pixel Density Thermal Imager Array N Paul, R Reddy, R Mohanty, SRK Vanjari, SG Singh Electrochemical Society Meeting Abstracts 237, 2315-2315, 2020 | | 2020 |
| Thermal and Optoelectrical Analysis of La0.7Sr0.3MnO3 Thin Film Thermistor in 8–12 μm Range for Uncooled Microbolometer Application N Paul, S Vadnala, A Agrawal, SR Vanjari, SG Singh 2018 IEEE Electron Devices Kolkata Conference (EDKCON), 55-59, 2018 | | 2018 |
| Dependency of fT and fMAX on Various Device Parameters of AIGaN/GaN HEMT N Paul, SG Singh 2018 IEEE Electron Devices Kolkata Conference (EDKCON), 581-586, 2018 | | 2018 |
| Silicide based low temperature and low pressure bonding of Ti/Si for microfludic and hermetic selaling application CH Kumar, AK Pnaigrahi, N Paul, S Bonam, SRK Vanjari, SG Singh, ... 2018 IEEE International Interconnect Technology Conference (IITC), 91-93, 2018 | | 2018 |
| BULK MICRO MACHINED SI MICROBOLOMETER AND THE METHOD OF FABRICATION THEREOF P NIRUPAM, R RANGA R, K CHANDA, M RADHARAMANA, ... IN Patent IN201,641,040,755 A, 2018 | | 2018 |
| WoW Post-CMOS compatible Cu-Cu Low temperature, Low pressure thermocompression bonding with Pd passivation Engineering CH Kumar, AK Panigrahi, S Bonam, N Paul, S Vadnala, SRK Vanjari, ... | | |
Shiv Govind SinghProfessor, Electrical Engineering, IITHyderabad在 ee.iith.ac.in 的电子邮件经过验证
