| Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes MS Ibrahim, J Fan, WKC Yung, A Prisacaru, W van Driel, X Fan, G Zhang Laser & Photonics Reviews, 2020 | 55 | 2020 |
| Lumen degradation lifetime prediction for high-power white LEDs based on the gamma process model MS Ibrahim, J Fan, WKC Yung, Z Wu, B Sun IEEE Photonics Journal 11 (6), 1-16, 2019 | 36 | 2019 |
| Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network Z Jing, J Liu, MS Ibrahim, J Fan, X Fan, G Zhang IEEE Electron Device Letters 41 (12), 1817 - 1820, 2020 | 31 | 2020 |
| System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method MS Ibrahim, J Fan, WKC Yung, Z Jing, X Fan, W van Driel, G Zhang Measurement 176, 109191, 2021 | 20 | 2021 |
| Bayesian based lifetime prediction for high-power white LEDs MS Ibrahim, Z Jing, WKC Yung, J Fan Expert Systems with Applications 185, 115627, 2021 | 12 | 2021 |
| A Gamma process-based degradation testing of silicone encapsulant used in LED packaging J Fan, Y Chen, Z Jing, MS Ibrahim, M Cai Polymer Testing 96, 107090, 2021 | 12 | 2021 |
| Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints J Fan, J Wu, C Jiang, H Zhang, M Ibrahim, L Deng Materials 13 (1), 94, 2019 | 10 | 2019 |
| Lumen maintenance lifetime prediction for Phosphor-converted white LEDs with a Wiener process based model MS Ibrahim, WKC Yung, J Fan 2018 20th International Conference on Electronic Materials and Packaging …, 2018 | 8 | 2018 |
| A thin and low-inductance 1200 V SiC MOSFET fan-out panel-level packaging with thermal cycling reliability evaluation W Chen, J Jiang, AH Meda, MS Ibrahim, G Zhang, J Fan IEEE Transactions on Electron Devices 70 (5), 2268-2275, 2023 | 7 | 2023 |
| Lifetime prediction of ultraviolet light-emitting diodes with accelerated Wiener degradation process Z Jing, MS Ibrahim, J Fan, X Fan, G Zhang 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 7 | 2019 |
| The effect of pre-existing voids on solder reliability at different thermomechanical stress levels: Experimental assessment A Waseem, MS Ibrahim, C Lu, M Waseem, HH Lee, KH Loo Materials & Design 233, 112275, 2023 | 6 | 2023 |
| Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models J Fan, Z Jing, Y Cao, MS Ibrahim, M Li, X Fan, G Zhang Energy and AI 4, 2021 | 5 | 2021 |
| In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks M Wen, MS Ibrahim, AH Meda, G Zhang, J Fan Expert Systems with Applications 238, 121832, 2024 | 4 | 2024 |
| Defect and texture engineering of relaxor thin films for High-Power energy storage applications W Abbas, MS Ibrahim, M Waseem, C Lu, HH Lee, S Fazal, KH Loo, ... Chemical Engineering Journal, 148943, 2024 | 3 | 2024 |
| Long-Term Lifetime Prediction of Power MOSFET Devices Based on LSTM and GRU Algorithms MS Ibrahim, W Abbas, M Waseem, C Lu, HH Lee, J Fan, KH Loo Mathematics 11 (15), 3283, 2023 | 3 | 2023 |
| A hybrid degradation modeling of light-emitting diode using permutation entropy and data-driven methods M Wen, Z Jing, MS Ibrahim, J Fan, G Zhang 2021 22nd International Conference on Electronic Packaging Technology (ICEPT …, 2021 | 3 | 2021 |
| Life cycle assessment of high-power white LEDs for indoor lighting in the context of Hong Kong MS Ibrahim, WKC Yung, J Fan Lighting Research & Technology, 14771535241234053, 2024 | 1 | 2024 |
| Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling M Liu, W Li, W Chen, MS Ibrahim, J Xiong, G Zhang, J Fan Case Studies in Thermal Engineering 54, 103940, 2024 | 1 | 2024 |
| Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm W Chen, X Yan, MS Ibrahim, AH Meda, X Fan, G Zhang, J Fan 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2007-2011, 2023 | 1 | 2023 |
| Health Monitoring, Machine Learning, and Digital Twin for LED Degradation Analysis MS Ibrahim, Z Jing, J Fan Reliability of Organic Compounds in Microelectronics and Optoelectronics …, 2022 | 1 | 2022 |
Jiajie FANResearcher at Fudan University在 connect.polyu.hk 的电子邮件经过验证
