| Electrochemical migration in electronic materials: factors affecting the mechanism and recent strategies for inhibition EL Lee, YS Goh, A Haseeb, YH Wong, MFM Sabri, BY Low Journal of The Electrochemical Society 170 (2), 021505, 2023 | 10 | 2023 |
| Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers Y Goh, YS Goh, EL Lee, MT Ong, A Haseeb Journal of Materials Science: Materials in Electronics 29, 5791-5798, 2018 | 6 | 2018 |
| Formation and nanomechanical properties of intermetallic compounds in electrodeposited Cu–Sn–Co multilayers YS Goh, Y Goh, PY Chia, A Haseeb Journal of Materials Science: Materials in Electronics 32, 9490-9499, 2021 | 2 | 2021 |
| Effects of Concentration of Adipic Acid on the Electrochemical Migration of Tin for Printed Circuit Board Assembly YS Goh, A Haseeb, WJ Basirun, YH Wong, MFM Sabri, BY Low Journal of Electronic Materials 52 (3), 2236-2249, 2023 | | 2023 |
