Jie WEI 个人学术档案 - 学术资源搜索

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Jie WEI

Rigoron

在 rigoron.com 的电子邮件经过验证


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
A thermal-driven floorplanning algorithm for 3D ICs J Cong, J Wei, Y Zhang IEEE/ACM International Conference on Computer Aided Design, 2004. ICCAD-2004 …, 2004	561	2004
Thermal-aware 3D IC placement via transformation J Cong, G Luo, J Wei, Y Zhang 2007 Asia and South Pacific Design Automation Conference, 780-785, 2007	222	2007
An automated design flow for 3D microarchitecture evaluation J Cong, A Jagannathan, Y Ma, G Reinman, J Wei, Y Zhang Proceedings of the 2006 Asia and South Pacific Design Automation Conference …, 2006	66	2006

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