| Effects of wire-EDM machining variables on surface roughness of newly developed DC 53 die steel: Design of experiments and regression model K Kanlayasiri, S Boonmung Journal of materials processing technology 192, 459-464, 2007 | 227 | 2007 |
| An investigation on effects of wire-EDM machining parameters on surface roughness of newly developed DC53 die steel K Kanlayasiri, S Boonmung Journal of materials processing technology 187, 26-29, 2007 | 147 | 2007 |
| Influence of indium addition on characteristics of Sn–0.3 Ag–0.7 Cu solder alloy K Kanlayasiri, M Mongkolwongrojn, T Ariga Journal of Alloys and Compounds 485 (1-2), 225-230, 2009 | 144 | 2009 |
| Evolution of intermetallic compounds between Sn-0.3 Ag-0.7 Cu low-silver lead-free solder and Cu substrate during thermal aging N Mookam, K Kanlayasiri Journal of Materials Science & Technology 28 (1), 53-59, 2012 | 77 | 2012 |
| Physical properties of Sn58Bi–xNi lead-free solder and its interfacial reaction with copper substrate K Kanlayasiri, T Ariga Materials & Design 86, 371-378, 2015 | 67 | 2015 |
| Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate K Kanlayasiri, K Sukpimai Journal of Alloys and Compounds 668, 169-175, 2016 | 58 | 2016 |
| Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3 Ag–0.7 Cu low-silver lead-free solder and Cu substrate N Mookam, K Kanlayasiri Journal of Alloys and Compounds 509 (21), 6276-6279, 2011 | 57 | 2011 |
| Simultaneous optimization of dimensional accuracy and surface roughness for finishing cut of wire-EDMed K460 tool steel K Kanlayasiri, P Jattakul Precision engineering 37 (3), 556-561, 2013 | 48 | 2013 |
| Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate P Tunthawiroon, K Kanlayasiri Transactions of Nonferrous Metals Society of China 29 (8), 1696-1704, 2019 | 44 | 2019 |
| Influence of thermal aging on microhardness and microstructure of Sn–0.3 Ag–0.7 Cu–xIn lead-free solders K Kanlayasiri, T Ariga Journal of Alloys and Compounds 504 (1), L5-L9, 2010 | 34 | 2010 |
| A nickel aluminide microchannel array heat exchanger for high-temperature applications K Kanlayasiri, BK Paul Journal of manufacturing processes 6 (1), 72-80, 2004 | 31 | 2004 |
| Property alterations of Sn-0.6 Cu-0.05 Ni-Ge lead-free solder by Ag, Bi, in and Sb addition K Kanlayasiri, R Kongchayasukawat Transactions of Nonferrous Metals Society of China 28 (6), 1166-1175, 2018 | 30 | 2018 |
| Evaluation of artificial neural networks for pineapple grading S Boonmung, B Chomtee, K Kanlayasiri Journal of texture studies 37 (5), 568-579, 2006 | 25 | 2006 |
| Effects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering N Mookam, P Tunthawiroon, K Kanlayasiri IOP Conference Series: Materials Science and Engineering 361 (1), 012008, 2018 | 22 | 2018 |
| Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste K Kanlayasiri, N Meesathien Advances in Materials Science and Engineering 2018 (1), 3750742, 2018 | 21 | 2018 |
| Resistance spot welding of SUS316L austenitic/SUS425 ferritic stainless steels: Weldment characteristics, mechanical properties, phase transformation and solidification T Khuenkaew, K Kanlayasiri Metals 9 (6), 710, 2019 | 16 | 2019 |
| Effect of bending temperatures on the microstructure and springback of a TRIP steel sheet N Pornputsiri, K Kanlayasiri Defence Technology 16 (5), 980-987, 2020 | 13 | 2020 |
| Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders K Kanlayasiri, N Mookam Transactions of Nonferrous Metals Society of China 32 (4), 1226-1241, 2022 | 9 | 2022 |
| Effect of Si on microstructure and corrosion behavior of CoCrMo alloys C Peaubuapuan, P Tunthawiroon, K Kanlayasiri, C Yuangyai IOP Conference Series: Materials Science and Engineering 361 (1), 012004, 2018 | 9 | 2018 |
| Improving the performance of EDM deep hole using multi-hole interior flushing electrode S Chuvaree, K Kanlayasiri IOP Conference Series: Materials Science and Engineering 361 (1), 012013, 2018 | 9 | 2018 |
