| Key components of modular propulsion systems for next generation electric vehicles A Stippich, CH Van Der Broeck, A Sewergin, AH Wienhausen, M Neubert, ... CPSS Transactions on Power Electronics and Applications 2 (4), 249-258, 2017 | 152 | 2017 |
| IGBT junction temperature estimation via gate voltage plateau sensing CH van der Broeck, A Gospodinov, RW De Doncker IEEE Transactions on Industry Applications 54 (5), 4752-4763, 2018 | 118 | 2018 |
| Spatial electro-thermal modeling and simulation of power electronic modules CH van der Broeck, LA Ruppert, A Hinz, M Conrad, RW De Doncker IEEE Transactions on Industry Applications 54 (1), 404-415, 2017 | 92 | 2017 |
| Methodology for active thermal cycle reduction of power electronic modules CH van der Broeck, LA Ruppert, RD Lorenz, RW De Doncker IEEE Transactions on Power Electronics 34 (8), 8213-8229, 2019 | 78 | 2019 |
| Intelligent Gate Drivers for Future Power Converters J Henn, C Ludecke, M Laumen, S Beushausen, S Kalker, ... IEEE Transactions on Power Electronics, 2021 | 74 | 2021 |
| Monitoring 3-D temperature distributions and device losses in power electronic modules CH van der Broeck, RD Lorenz, RW De Doncker IEEE Transactions on Power Electronics 34 (8), 7983-7995, 2019 | 64 | 2019 |
| Research on Active Thermal Control: Actual Status and Future J Kuprat, CH van der Broeck, M Andresen, S Kalker, RWD Doncker, ... IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021 | 58 | 2021 |
| Reviewing Thermal Monitoring Techniques for Smart Power Modules S Kalker, L Ruppert, CH van der Broeck, J Kupprat, M Andresen, T Polom, ... IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021 | 58 | 2021 |
| Active thermal cycle reduction of power modules via gate resistance manipulation CH van der Broeck, LA Ruppert, RD Lorenz, RW De Doncker 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 3074-3082, 2018 | 51 | 2018 |
| Real-Time Monitoring of Thermal Response and Life-Time Varying Parameters in Power Modules CH van der Broeck, TA Polom, RD Lorenz, RW De Doncker IEEE Transactions on Industry Applications, 2020 | 42 | 2020 |
| Unified control of a buck converter for wide load range applications CH van der Broeck, RW De Doncker, SA Richter, J Von Bloh IEEE Transactions on Industry Applications, 2015 | 38 | 2015 |
| A thermal modeling methodology for power semiconductor modules CH van der Broeck, M Conrad, RW De Doncker Microelectronics Reliability 55 (9-10), 1938-1944, 2015 | 33 | 2015 |
| Dynamic control of a dual active bridge for bidirectional ac charging M Rosekeit, C van der Broeck, RW De Doncker 2015 IEEE International Conference on Industrial Technology (ICIT), 2085-2091, 2015 | 30 | 2015 |
| Online junction-temperature sensing of SiC MOSFETs with minimal calibration effort S Kalker, CH van der Broeck, RW De Doncker PCIM Europe digital days 2020; International Exhibition and Conference for …, 2020 | 29 | 2020 |
| In-situ Thermal Impedance Spectroscopy of Power Electronic Modules for Localized Degradation Identification CH van der Broeck, S Kalker, TA Polom, RD Lorenz, RW De Doncker PCIM Europe 2019, 2019 | 29 | 2019 |
| Methodology for analysis and design of discrete time current controllers for three-phase PWM converters CH Van Der Broeck, SA Richter, J Von Bloh, RW De Doncker CPSS Transactions on Power Electronics and Applications 3 (3), 254-264, 2018 | 29 | 2018 |
| Discrete time modeling, implementation and design of current controllers CH van der Broeck, RW De Doncker, SA Richter, J von Bloh 2014 IEEE Energy Conversion Congress and Exposition (ECCE), 540-547, 2014 | 28 | 2014 |
| Analysis and design of repetitive controllers for applications in distorted distribution grids P Schülting, CH van der Broeck, RW De Doncker IEEE Transactions on Power Electronics 34 (1), 996-1004, 2018 | 27 | 2018 |
| Methods for monitoring 3-d temperature distributions in power electronic modules CH van der Broeck, RD Lorenz, RW De Doncker 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 3022-3030, 2018 | 27 | 2018 |
| Next Generation Monitoring of SiC MOSFETs via Spectral Electroluminescence Sensing S Kalker, CH van der Broeck, L Ruppert, R De Doncker IEEE Transactions on Industry Applications, 2021 | 26 | 2021 |
Rik De DonckerProfessor, RWTH Aachen University在 ieee.org 的电子邮件经过验证
