Development of a parallel semi-implicit two-dimensional plasma fluid modeling code using finite-volume method KM Lin, CT Hung, FN Hwang, MR Smith, YW Yang, JS Wu Computer Physics Communications 183 (6), 1225-1236, 2012 | 44 | 2012 |
A parallel hybrid numerical algorithm for simulating gas flow and gas discharge of an atmospheric-pressure plasma jet KM Lin, MH Hu, CT Hung, JS Wu, FN Hwang, YS Chen, G Cheng Computer Physics Communications 183 (12), 2550-2560, 2012 | 21 | 2012 |
Statistical behavior of a single microdischarge in atmospheric-pressure air dielectric barrier discharges KM Lin, CM Ku, CH Cheng Physics of Plasmas 26 (1), 2019 | 13 | 2019 |
Thermal characterization of a single microdischarge in atmospheric pressure air dielectric barrier discharges KM Lin, SY Chuang, WY Guo, CH Cheng, CC Ou Plasma Sources Science and Technology 29 (7), 075002, 2020 | 12 | 2020 |
Development of a semi-empirical 1.5 D plasma fluid model for a single microdischarge in atmospheric pressure dielectric barrier discharges KM Lin, YH Huang, WY Guo, YS Chang Plasma Sources Science and Technology 28 (11), 115014, 2019 | 10 | 2019 |
Fluid modeling of a nitrogen atmospheric-pressure planar dielectric barrier discharge driven by a realistic distorted sinusoidal alternating current power source KW Cheng, CT Hung, KM Lin, YM Chiu, JS Wu, JP Yu Japanese Journal of Applied Physics 51 (11R), 116001, 2012 | 9 | 2012 |
Device and method for manufacturing a semiconductor structure KM Lin, KKK Koai, CT Lee, VY Lu, YH Lin US Patent 10,269,573, 2019 | 6 | 2019 |
Numerical investigation of a parallel-plate atmospheric-pressure nitrogen/ammonia dielectric barrier discharge FL Li, KM Lin, YW Yang, CT Hung, JS Wu, JP Yu Plasma Chemistry and Plasma Processing 32, 547-564, 2012 | 6 | 2012 |
Analysis of ozone generation in a planar atmospheric pressure air dielectric barrier discharge reactor KM Lin, TY Liao, JY Lin, M Abrar, YX Chen Plasma Sources Science and Technology 32 (2), 025007, 2023 | 5 | 2023 |
Gas heating mechanisms in atmospheric pressure helium dielectric-barrier discharges driven by a kHz power source KM Lin, KC Wang, YS Chang, SY Chuang Applied Sciences 10 (21), 7583, 2020 | 5 | 2020 |
Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate KM Lin, YH Lin, JH Li, TL Lee, C Ting-Gang, CT Ko US Patent 10,519,545, 2019 | 5 | 2019 |
Investigation of gas heating effect and induced pressure waves of a single microdischarge in atmospheric pressure dielectric barrier discharges KM Lin, CC Ou, KC Wang, ZW Liou, SY Chuang International Journal of Heat and Mass Transfer 165, 120527, 2021 | 4 | 2021 |
Characterization of OH species in kHz He/H2O atmospheric pressure dielectric barrier discharges JY Lin, CL Huang, JW Chen, KM Lin, CC Ou, YH Wu Plasma Sources Science and Technology 31 (7), 075005, 2022 | 3 | 2022 |
A temporal multi-scale algorithm for efficient fluid modeling of a one-dimensional gas discharge BR Gu, KM Lin, MH Hu, CT Hung, JS Wu, YS Chen Plasma Sources Science and Technology 23 (6), 065021, 2014 | 3 | 2014 |
Development of an improved spatial reconstruction technique for the HLL method and its applications MR Smith, KM Lin, CT Hung, YS Chen, JS Wu Journal of Computational Physics 230 (3), 477-493, 2011 | 3 | 2011 |
Numerical and experimental investigation of light emissions of a planar nitrogen atmospheric-pressure dielectric barrier discharge due to addition of ammonia considering oxygen … FL Li, CT Hung, KM Lin, TC Wei, JS Wu Plasma Sources Science and Technology 22 (6), 065003, 2013 | 2 | 2013 |
Development of a semi-implicit fluid modeling code using finite-volume method based on Cartesian grids MR Smith, CT Hung, KM Lin, JS Wu, JP Yu Computer Physics Communications 182 (1), 170-172, 2011 | 1 | 2011 |
Non-Thermal Plasma Simulation Using Parallel Fluid Modeling Code CT Hung, MH Hu, YM Chiu, KM Lin, YC Wang, JS Wu HPC-Asia, 2009 | 1 | 2009 |
Characterization of OH species in kHz air/H2O atmospheric pressure dielectric barrier discharges CL Huang, TY Liao, YT He, GJ Lin, WH Lai, YC Chen, KM Lin Plasma Sources Science and Technology 33 (6), 065005, 2024 | | 2024 |
Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate KM Lin, YH Lin, JH Li, TL Lee, C Ting-Gang, CT Ko US Patent 11,725,278, 2023 | | 2023 |