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Kun-Mo Lin
Kun-Mo Lin
Mechanical engineering, National Chung Cheng University
在 ccu.edu.tw 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Development of a parallel semi-implicit two-dimensional plasma fluid modeling code using finite-volume method
KM Lin, CT Hung, FN Hwang, MR Smith, YW Yang, JS Wu
Computer Physics Communications 183 (6), 1225-1236, 2012
442012
A parallel hybrid numerical algorithm for simulating gas flow and gas discharge of an atmospheric-pressure plasma jet
KM Lin, MH Hu, CT Hung, JS Wu, FN Hwang, YS Chen, G Cheng
Computer Physics Communications 183 (12), 2550-2560, 2012
212012
Statistical behavior of a single microdischarge in atmospheric-pressure air dielectric barrier discharges
KM Lin, CM Ku, CH Cheng
Physics of Plasmas 26 (1), 2019
132019
Thermal characterization of a single microdischarge in atmospheric pressure air dielectric barrier discharges
KM Lin, SY Chuang, WY Guo, CH Cheng, CC Ou
Plasma Sources Science and Technology 29 (7), 075002, 2020
122020
Development of a semi-empirical 1.5 D plasma fluid model for a single microdischarge in atmospheric pressure dielectric barrier discharges
KM Lin, YH Huang, WY Guo, YS Chang
Plasma Sources Science and Technology 28 (11), 115014, 2019
102019
Fluid modeling of a nitrogen atmospheric-pressure planar dielectric barrier discharge driven by a realistic distorted sinusoidal alternating current power source
KW Cheng, CT Hung, KM Lin, YM Chiu, JS Wu, JP Yu
Japanese Journal of Applied Physics 51 (11R), 116001, 2012
92012
Device and method for manufacturing a semiconductor structure
KM Lin, KKK Koai, CT Lee, VY Lu, YH Lin
US Patent 10,269,573, 2019
62019
Numerical investigation of a parallel-plate atmospheric-pressure nitrogen/ammonia dielectric barrier discharge
FL Li, KM Lin, YW Yang, CT Hung, JS Wu, JP Yu
Plasma Chemistry and Plasma Processing 32, 547-564, 2012
62012
Analysis of ozone generation in a planar atmospheric pressure air dielectric barrier discharge reactor
KM Lin, TY Liao, JY Lin, M Abrar, YX Chen
Plasma Sources Science and Technology 32 (2), 025007, 2023
52023
Gas heating mechanisms in atmospheric pressure helium dielectric-barrier discharges driven by a kHz power source
KM Lin, KC Wang, YS Chang, SY Chuang
Applied Sciences 10 (21), 7583, 2020
52020
Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate
KM Lin, YH Lin, JH Li, TL Lee, C Ting-Gang, CT Ko
US Patent 10,519,545, 2019
52019
Investigation of gas heating effect and induced pressure waves of a single microdischarge in atmospheric pressure dielectric barrier discharges
KM Lin, CC Ou, KC Wang, ZW Liou, SY Chuang
International Journal of Heat and Mass Transfer 165, 120527, 2021
42021
Characterization of OH species in kHz He/H2O atmospheric pressure dielectric barrier discharges
JY Lin, CL Huang, JW Chen, KM Lin, CC Ou, YH Wu
Plasma Sources Science and Technology 31 (7), 075005, 2022
32022
A temporal multi-scale algorithm for efficient fluid modeling of a one-dimensional gas discharge
BR Gu, KM Lin, MH Hu, CT Hung, JS Wu, YS Chen
Plasma Sources Science and Technology 23 (6), 065021, 2014
32014
Development of an improved spatial reconstruction technique for the HLL method and its applications
MR Smith, KM Lin, CT Hung, YS Chen, JS Wu
Journal of Computational Physics 230 (3), 477-493, 2011
32011
Numerical and experimental investigation of light emissions of a planar nitrogen atmospheric-pressure dielectric barrier discharge due to addition of ammonia considering oxygen …
FL Li, CT Hung, KM Lin, TC Wei, JS Wu
Plasma Sources Science and Technology 22 (6), 065003, 2013
22013
Development of a semi-implicit fluid modeling code using finite-volume method based on Cartesian grids
MR Smith, CT Hung, KM Lin, JS Wu, JP Yu
Computer Physics Communications 182 (1), 170-172, 2011
12011
Non-Thermal Plasma Simulation Using Parallel Fluid Modeling Code
CT Hung, MH Hu, YM Chiu, KM Lin, YC Wang, JS Wu
HPC-Asia, 2009
12009
Characterization of OH species in kHz air/H2O atmospheric pressure dielectric barrier discharges
CL Huang, TY Liao, YT He, GJ Lin, WH Lai, YC Chen, KM Lin
Plasma Sources Science and Technology 33 (6), 065005, 2024
2024
Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate
KM Lin, YH Lin, JH Li, TL Lee, C Ting-Gang, CT Ko
US Patent 11,725,278, 2023
2023
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