Boost up mobility of solution‐processed metal oxide thin‐film transistors via confining structure on electron pathways YS Rim, H Chen, X Kou, HS Duan, H Zhou, M Cai, HJ Kim, Y Yang Advanced Materials 26 (25), 4273-4278, 2014 | 219 | 2014 |
Effect of substrate temperature on the structural and electrical properties of CIGS films based on the one-stage co-evaporation process H Wang, Y Zhang, XL Kou, YA Cai, W Liu, T Yu, JB Pang, CJ Li, Y Sun Semiconductor science and technology 25 (5), 055007, 2010 | 87 | 2010 |
Homoepitaxial Growth of InP on Electrochemical Etched Porous InP Surface X Kou, A Machness, E Paluch, M Goorsky ECS Journal of Solid State Science and Technology 7 (5), P269, 2018 | 5 | 2018 |
Laser-Assisted Chemical Polishing of Silicon (112) Wafers N Dandekar, R Chivas, S Silverman, X Kou, M Goorsky Journal of electronic materials 41, 2790-2794, 2012 | 5 | 2012 |
Development of Porous InP for Subsequent Epitaxial Layer Transfer onto Flexible Substrates X Kou, MS Goorsky ECS Transactions 50 (7), 325, 2013 | 3 | 2013 |
Cleave Engineered Layer Transfer for III-V Devices via Electrochemical Etched Porous Indium Phosphide X Kou University of California, Los Angeles, 2014 | 2 | 2014 |
Epitaxial Growth and Layer Transfer of InP through Electrochemically Etched and Annealed Porous Buried Layers D Chen, X Kou, S Sareminaeini, MS Goorsky ECS Transactions 64 (5), 49, 2014 | 1 | 2014 |
Epitaxial growth and layer transfer of InP via electrochemically etching/annealing of porous buried InP layers: A pathway for III–V substrate re-use X Kou, MS Goorsky 2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC), 1-3, 2015 | | 2015 |
Advanced Characterization of a Direct Wafer Bonding-compatible Germanium Exfoliation Process IP Ferain, X Kou, C Moulet-Ventosa, MS Goorsky, C Colinge ECS Transactions 50 (7), 331, 2013 | | 2013 |
Electrochemical Etched InP Porous Layer Formation for Layer Transfer X Kou, M Goorsky Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2011 | | 2011 |