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Xiaolu Kou
Xiaolu Kou
Western Digital
在 ucla.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Boost up mobility of solution‐processed metal oxide thin‐film transistors via confining structure on electron pathways
YS Rim, H Chen, X Kou, HS Duan, H Zhou, M Cai, HJ Kim, Y Yang
Advanced Materials 26 (25), 4273-4278, 2014
2192014
Effect of substrate temperature on the structural and electrical properties of CIGS films based on the one-stage co-evaporation process
H Wang, Y Zhang, XL Kou, YA Cai, W Liu, T Yu, JB Pang, CJ Li, Y Sun
Semiconductor science and technology 25 (5), 055007, 2010
872010
Homoepitaxial Growth of InP on Electrochemical Etched Porous InP Surface
X Kou, A Machness, E Paluch, M Goorsky
ECS Journal of Solid State Science and Technology 7 (5), P269, 2018
52018
Laser-Assisted Chemical Polishing of Silicon (112) Wafers
N Dandekar, R Chivas, S Silverman, X Kou, M Goorsky
Journal of electronic materials 41, 2790-2794, 2012
52012
Development of Porous InP for Subsequent Epitaxial Layer Transfer onto Flexible Substrates
X Kou, MS Goorsky
ECS Transactions 50 (7), 325, 2013
32013
Cleave Engineered Layer Transfer for III-V Devices via Electrochemical Etched Porous Indium Phosphide
X Kou
University of California, Los Angeles, 2014
22014
Epitaxial Growth and Layer Transfer of InP through Electrochemically Etched and Annealed Porous Buried Layers
D Chen, X Kou, S Sareminaeini, MS Goorsky
ECS Transactions 64 (5), 49, 2014
12014
Epitaxial growth and layer transfer of InP via electrochemically etching/annealing of porous buried InP layers: A pathway for III–V substrate re-use
X Kou, MS Goorsky
2015 IEEE 42nd Photovoltaic Specialist Conference (PVSC), 1-3, 2015
2015
Advanced Characterization of a Direct Wafer Bonding-compatible Germanium Exfoliation Process
IP Ferain, X Kou, C Moulet-Ventosa, MS Goorsky, C Colinge
ECS Transactions 50 (7), 331, 2013
2013
Electrochemical Etched InP Porous Layer Formation for Layer Transfer
X Kou, M Goorsky
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2011
2011
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