| Scalable fabrication of organic single-crystalline wafers for reproducible TFT arrays S Kumagai, A Yamamura, T Makita, J Tsurumi, YY Lim, T Wakimoto, ... Scientific Reports 9 (1), 15897, 2019 | 56 | 2019 |
| Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects SR Vempati, N Su, CH Khong, YY Lim, K Vaidyanathan, JH Lau, BP Liew, ... 2009 59th Electronic Components and Technology Conference, 980-987, 2009 | 55 | 2009 |
| Low-loss broadband package platform with surface passivation and TSV for wafer-level packaging of RF-MEMS devices B Chen, VN Sekhar, C Jin, YY Lim, JS Toh, S Fernando, J Sharma IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013 | 46 | 2013 |
| Implementation of packaged integrated antenna with embedded front end for Bluetooth applications M Rotaru, LY Ying, H Kuruveettil, Y Rui, AP Popov, C Chee-Parng IEEE Transactions on Advanced Packaging 31 (3), 558-567, 2008 | 25 | 2008 |
| Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications YY Lim, YM Goh, C Liu Industrial & Engineering Chemistry Research 52 (33), 11564-11574, 2013 | 23 | 2013 |
| High quality and low loss millimeter wave passives demonstrated to 77-GHz for SiP technologies using embedded wafer-level packaging platform (EMWLP) YY Lim, X Xiao, SR Vempati, N Su, A Kumar, G Sharma, TG Lim, ... IEEE Transactions on Advanced Packaging 33 (4), 1061-1071, 2010 | 23 | 2010 |
| Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP) YY Lim, SR Vempati, N Su, X Xiao, J Zhou, A Kumar, PP Thaw, G Sharma, ... 2009 59th Electronic Components and Technology Conference, 508-515, 2009 | 21 | 2009 |
| Temperature dependency on Ce-doped CuO nanoparticles: a comparative study via XRD line broadening analysis SJ Singh, YY Lim, JJL Hmar, P Chinnamuthu Applied Physics A 128 (3), 188, 2022 | 19 | 2022 |
| Wafer Level Package and a Method of Forming the Same TG Lim, YY Lim, YM Khoo, NKO Kalandar, F Che, SC Chong, SWD Ho, ... US Patent App. 13/407,295, 2013 | 19 | 2013 |
| Embedding of 15um thin chip and passives in thin flexible substrate R Rajoo, YY Lim, SC Chong, M Paing, FD Moses, JSTW Hong, ... 2010 12th electronics packaging technology conference, 489-496, 2010 | 10 | 2010 |
| Simple and improved dielectric parameter extraction of thin organic packaging materials using open-ended coaxial line technique YY Lim, MD Rotaru, A Alphones, AP Popov IEE Proceedings-Microwaves, Antennas and Propagation 152 (4), 214-220, 2005 | 9 | 2005 |
| 30-GHz high-frequency application of screen printed interconnects on an organic substrate YY Lim, YM Goh, M Yoshida, TT Bui, M Aoyagi, C Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 7 | 2017 |
| Thin and flexible printed antenna designed for curved metal surfaces YY Lim, Y Kimura, MD Hardy, S Watanabe, J Takeya Flexible and Printed Electronics 6 (4), 045001, 2021 | 6 | 2021 |
| Silver screen printed transmission lines-analyzing the influence of substrate roughness on the RF performance up to 30 GHz YY Lim, YM Goh, M Yoshida, TT Bui, T Vincent, M Aoyagi, C Liu 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 22-26, 2014 | 5 | 2014 |
| Process and reliability of embedded micro-wafer-level package (EMWLP) using low cure temperature dielectric material VS Rao, VN Sekhar, HS Wee, R Rajoo, G Sharma, LY Ying, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (1 …, 2012 | 5 | 2012 |
| A broadband 3D package for RF MEMS devices utilizing through silicon vias (TSV) YY Lim, BT Chen, AB Yu, JL Shi 2011 16th International Solid-State Sensors, Actuators and Microsystems …, 2011 | 5 | 2011 |
| Electrical and dielectric parameters in TiO2-NW/Ge-NW heterostructure MOS device synthesized by glancing angle deposition technique HM Singh, YY Lim, P Chinnamuthu Scientific Reports 11, 1-10, 2021 | 3 | 2021 |
| Fine Cone-shaped Bumps for Three-dimensional LSI Package--An Optimization of Thermocompression Bonding Process. S Nemoto, YY Lim, H Nakagawa, K Kikuchi, M Aoyagi Sensors & Materials 30, 2018 | 3 | 2018 |
| Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces YY Lim, YM Goh, C Liu, D Hutt Surface and Coatings Technology 266, 93-104, 2015 | 3 | 2015 |
| Semiconductor package and method of forming the same KF Chang, Y Han, DSW Ho, YY Lim US Patent 11,569,146, 2023 | 2 | 2023 |
vempati Srinivasa raoInstitute of Microelectronics在 ime.a-star.edu.sg 的电子邮件经过验证
vempati Srinivasa raoInstitute of Microelectronics在 ime.a-star.edu.sg 的电子邮件经过验证
Mihai RotaruInstitute of Microelectronics在 ime.a-star.edu.sg 的电子邮件经过验证