| Measurement of elastic properties of epoxy molding compound by single cylindrical configuration with embedded fiber Bragg grating sensor Y Sun, HS Lee, B Han Experimental mechanics 57 (2), 313-324, 2017 | 25 | 2017 |
| Characterization of linear viscoelastic behavior of epoxy molding compound subjected to uniaxial compression and hydrostatic pressure HS Lee, Y Sun, C Kim, B Han IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (8 …, 2018 | 16 | 2018 |
| Measurement of effective cure shrinkage of epoxy‐based molding compound by fiber Bragg grating sensor using two‐stage curing process C Kim, SP Phansalkar, HS Lee, B Han Journal of Applied Polymer Science, 51620, 0 | 14 | |
| Non-linear viscoelastic modeling of epoxy based molding compound for large deformations encountered in power modules PJ Gromala, A Prisacaru, M Jeronimo, HS Lee, Y Sun, B Han 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 834-840, 2017 | 7 | 2017 |
| On Curing-Induced Residual Stresses After Molding Processes: Mold Shrinkage, Chemical Shrinkage or Both? C Kim, S Phansalkar, HS Lee, B Han 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1382-1386, 2019 | 5 | 2019 |
| Measurement of the comprehensive viscoelastic properties of advanced EMC using FBG sensor Y Sun, HS Lee, B Han 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 531-537, 2016 | 4 | 2016 |
| Constant Poisson’s Ratio of Thermosetting Polymers: Is It Reasonable for Accurate Thermal Stress Analysis? HS Lee, S Phansalkar, B Han 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2092-2096, 2020 | 1 | 2020 |
| Effect of Time-Dependent Bulk Modulus on Reliability Assessment of Automotive Electronic Control Unit HS Lee, B Han, P Gromala 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1529-1534, 2019 | 1 | 2019 |
| Comprehensive Viscoelastic Properties Characterization of EMC Using FBG Sensor Y Sun, HS Lee, B Han Challenges in Mechanics of Time Dependent Materials, Volume 2, 173-180, 2017 | | 2017 |
