CMOS reliability from past to future: A survey of requirements, trends, and prediction methods I Hill, P Chanawala, R Singh, SA Sheikholeslam, A Ivanov IEEE Transactions on Device and Materials Reliability 22 (1), 1-18, 2021 | 24 | 2021 |
Gerabaldi: A Temporal Simulator for Probabilistic IC Degradation and Failure Processes I Hill, A Ivanov 2023 IEEE 41st VLSI Test Symposium (VTS), 1-7, 2023 | 1 | 2023 |
Enhanced Wear-Out Sensor Design in a 12nm Process for Separable Stress Regime Monitoring I Hill, M Rendón, A Ivanov 2024 IEEE 42nd VLSI Test Symposium (VTS), 1-7, 2024 | | 2024 |
A Novel Induced Offset Voltage Sensor for Separable Wear-Out Mechanism Characterization in a 12nm FinFET Process I Hill, M Rendón, A Ivanov 2024 IEEE International Reliability Physics Symposium (IRPS), 8A. 4-1-8A. 4-9, 2024 | | 2024 |
Prediction of Thermally Accelerated Aging Process at 28nm PA Chanawala, I Hill, SA Sheikholeslam, A Ivanov 2022 IEEE European Test Symposium (ETS), 1-2, 2022 | | 2022 |
POS1-Prediction of Thermally Accelerated Aging Process at 28nm PA Chanawala, I Hill, SA Sheikholeslam, A Ivanov | | 2022 |
GraceFall: Visualizer for Diverse Wear-Out Reliability Degradation Data Spanning Multiple Time Scales M Tang, I Hill | | |