| Predicting damage and life expectancy of subsea power cables in offshore renewable energy applications F Dinmohammadi, D Flynn, C Bailey, M Pecht, C Yin, P Rajaguru, V Robu IEEE access 7, 54658-54669, 2019 | 56 | 2019 |
| Sintered silver finite element modelling and reliability based design optimisation in power electronic module P Rajaguru, H Lu, C Bailey Microelectronics Reliability 55 (6), 919-930, 2015 | 46 | 2015 |
| Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics P Rajaguru, H Lu, C Bailey, J Ortiz-Gonzalez, O Alatise 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 21 | 2015 |
| Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading P Rajaguru, H Lu, C Bailey International journal of fatigue 45, 61-70, 2012 | 18 | 2012 |
| Evaluation of SiC Schottky diodes using pressure contacts JO Gonzalez, O Alatise, AM Aliyu, P Rajaguru, A Castellazzi, L Ran, ... IEEE Transactions on Industrial Electronics 64 (10), 8213-8223, 2017 | 15 | 2017 |
| An initial consideration of silicon carbide devices in pressure-packages JAO Gonzalez, O Alatise, L Ran, P Mawby, P Rajaguru, C Bailey 2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2016 | 15 | 2016 |
| Modelling and analysis of vibration on power electronic module structure and application of model order reduction P. Rajaguru, H. Lu, C. Bailey, M. Bella Microelectronics Reliability 110, 2020 | 14 | 2020 |
| A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications P Rajaguru, JA Ortiz-Gonzalez, H Lu, C Bailey, O Alatise IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017 | 13 | 2017 |
| A time dependent damage indicator model for Sn3. 5Ag solder layer in power electronic module P Rajaguru, H Lu, C Bailey Microelectronics Reliability 55 (11), 2371-2381, 2015 | 11 | 2015 |
| Smart manufacturing with artificial intelligence and digital twin: A brief review A Malik, P Rajaguru, R Azzawi 2022 8th International Conference on Information Technology Trends (ITT …, 2022 | 9 | 2022 |
| Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables P Rajaguru, H Lu, C Bailey, A Castellazzi, V Pathirana, N Udugampola, ... Microelectronics Reliability 83, 146-156, 2018 | 8 | 2018 |
| Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3. 5Ag solder interconnect in power electronic module: a … P Rajaguru, H Lu, C Bailey, J Ortiz-Gonzalez, O Alatise Microelectronics Reliability 68, 77-85, 2017 | 7 | 2017 |
| Application of nonlinear fatigue damage models in power electronic module wirebond structure under various amplitude loadings P Rajaguru, H Lu, C Bailey Advances in Manufacturing 2, 239-250, 2014 | 7 | 2014 |
| Numerical modelling methodology for design of miniaturised integrated products-an application to 3D CMM micro-probe development P Rajaguru, S Stoyanov, YK Tang, C Bailey, J Claverley, R Leach, ... 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010 | 7 | 2010 |
| Application of particle swarm optimisation to evaluation of polymer cure kinetics models T Tilford, M Ferenets, JE Morris, A Krumme, S Pavuluri, PR Rajaguru, ... Journal of Algorithms & Computational Technology 4 (1), 121-146, 2010 | 6 | 2010 |
| PHM of Subsea Cables D Flynn, C Bailey, P Rajaguru, W Tang, C Yin Prognostics and Health Management of Electronics: Fundamentals, Machine …, 2018 | 5 | 2018 |
| Application of Kriging and radial basis function for reliability optimization in power modules P Rajaguru, S Stoyanov, H Lu, C Bailey Journal of Electronic Packaging 135 (2), 021009, 2013 | 5 | 2013 |
| Impact of wide band gap devices on power electronics packaging designs C Bailey, P Rajaguru, H Lu 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2017 | 4 | 2017 |
| Optimising thermo mechanical behaviour of power electronic module structures P Rajaguru, C Bailey, H Lu 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2016 | 4 | 2016 |
| Reduced order modelling for risk mitigation in design of miniaturised/integrated products S Stoyanov, P Rajaguru, YK Tang, C Bailey, J Claverley, R Leach 33rd International Spring Seminar on Electronics Technology, ISSE 2010, 402-407, 2010 | 4 | 2010 |
