| High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature P Lall, D Zhang, V Yadav, D Locker Microelectronics Reliability 62, 4-17, 2016 | 101 | 2016 |
| Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures up to 200° C P Lall, D Zhang, V Yadav, J Suhling, D Locker 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1924-1932, 2016 | 48 | 2016 |
| High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures P Lall, V Yadav, D Zhang, J Suhling, S Shantaram Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 40 | 2014 |
| Effect of Prolonged Storage up to 1-Year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200° C P Lall, D Zhang, V Yadav, J Suhling, D Locker 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1219-1230, 2017 | 38 | 2017 |
| High strain rate properties of SAC305 leadfree solder at high operating temperature after long-term storage P Lall, D Zhang, J Suhling 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 640-651, 2015 | 34 | 2015 |
| Material behavior of SAC305 under high strain rate at high temperature P Lall, D Zhang, V Yadav, J Suhling, S Shantaram Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 31 | 2014 |
| Evolution of high strain rate and high temperature mechanical properties of SAC305 with long term storage up to 1-year P Lall, D Zhang, J Suhling, D Locker 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 21 | 2017 |
| Transient dynamics model and 3d-dic analysis of new-candidate for jedec jesd22-b111 test board P Lall, K Dornala, D Zhang, D Xie, A Zhang 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 85-99, 2014 | 11 | 2014 |
| Reliability of SAC Leadfree Solders in Automotive Underhood Temperature-Vibration P Lall, V Yadav, D Zhang, J Suhling 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 8 | 2018 |
| Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments P Lall, V Yadav, D Zhang, J Suhling International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 5 | 2017 |
| High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature P Lall, D Zhang, V Yadav ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014 | 4 | 2014 |
| Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year P Lall, D Zhang, J Suhling, D Locker International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | | 2017 |
| Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature P Lall, D Zhang, J Suhling, D Locker ASME International Mechanical Engineering Congress and Exposition 57533 …, 2015 | | 2015 |
| DAMAGE PREDICTION IN SAC305 LEAD FREE ELECTRONICS SUBJECTED TO MECHANICAL SHOCK AFTER LONG-TERM STORAGE P Lall, D Zhang, D Locker | | |
