| Development, implementation, and characterization of a 64-element dual-polarized phased-array antenna module for 28-GHz high-speed data communications X Gu, D Liu, C Baks, O Tageman, B Sadhu, J Hallin, L Rexberg, P Parida, ... IEEE Transactions on Microwave Theory and Techniques 67 (7), 2975-2984, 2019 | 149 | 2019 |
| Server liquid cooling with chiller-less data center design to enable significant energy savings M Iyengar, M David, P Parida, V Kamath, B Kochuparambil, D Graybill, ... 2012 28th annual IEEE semiconductor thermal measurement and management …, 2012 | 143 | 2012 |
| Heat transport through atomic contacts N Mosso, U Drechsler, F Menges, P Nirmalraj, S Karg, H Riel, ... Nature nanotechnology 12 (5), 430, 2017 | 126 | 2017 |
| Fabrication, assembly, and testing of Cu-and Al-based microchannel heat exchangers F Mei, PR Parida, J Jiang, WJ Meng, SV Ekkad Journal of Microelectromechanical systems 17 (4), 869-881, 2008 | 84 | 2008 |
| Improving data center energy efficiency with advanced thermal management TJ Chainer, MD Schultz, PR Parida, MA Gaynes IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (8 …, 2017 | 80 | 2017 |
| Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers MP David, M Iyengar, P Parida, R Simons, M Schultz, M Gaynes, ... 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 75 | 2012 |
| Analysis of solidification of a semitransparent planar layer using the lattice Boltzmann method and the discrete transfer method R Raj, A Prasad, PR Parida, SC Mishra Numerical Heat Transfer, Part A: Applications 49 (3), 279-299, 2006 | 74 | 2006 |
| Cognitive recording and sharing E Andreassen, AW Hagleitner, PR Parida, AR Ranck US Patent 9,894,266, 2018 | 68 | 2018 |
| Dynamically limiting energy consumed by cooling apparatus TJ Chainer, MP David, MK Iyengar, PR Parida, RR Schmidt, MD Schultz US Patent 9,043,035, 2015 | 62 | 2015 |
| Impingement-based high performance cooling configurations for automotive power converters PR Parida, SV Ekkad, K Ngo International Journal of Heat and Mass Transfer 55 (4), 834-847, 2012 | 61 | 2012 |
| Thermal transfer structures coupling electronics card (s) to coolant-cooled structure (s) MP David, DP Graybill, MK Iyengar, V Kamath, BJ Kochuparambil, ... US Patent 8,913,384, 2014 | 58 | 2014 |
| Dynamically limiting energy consumed by cooling apparatus TJ Chainer, MP David, MK Iyengar, PR Parida, RR Schmidt, MD Schultz US Patent 9,052,722, 2015 | 55 | 2015 |
| Experimental and numerical investigation of confined oblique impingement configurations for high heat flux applications PR Parida, SV Ekkad, K Ngo International journal of thermal sciences 50 (6), 1037-1050, 2011 | 47 | 2011 |
| Embedded two-phase cooling of large three-dimensional compatible chips with radial channels M Schultz, F Yang, E Colgan, R Polastre, B Dang, C Tsang, M Gaynes, ... Journal of Electronic Packaging 138 (2), 021005, 2016 | 45 | 2016 |
| Impact of operating conditions on a chiller-less data center test facility with liquid cooled servers MP David, MK Iyengar, P Parida, RE Simons, M Schultz, M Gaynes, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 40 | 2012 |
| The ICECool fundamentals effort on evaporative cooling of microelectronics A Bar-Cohen, M Asheghi, TJ Chainer, SV Garimella, K Goodson, C Gorle, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 39 | 2021 |
| Coolant and ambient temperature control for chillerless liquid cooled data centers TJ Chainer, MP David, MK Iyengar, PR Parida, RE Simons US Patent 9,250,636, 2016 | 36 | 2016 |
| Embedded two-phase cooling of large 3D compatible chips with radial channels M Schultz, F Yang, E Colgan, R Polastre, B Dang, C Tsang, M Gaynes, ... International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 35 | 2015 |
| Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center PR Parida, M David, M Iyengar, M Schultz, M Gaynes, V Kamath, ... 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 34 | 2012 |
| Liquid cooled data center design selection TJ Chainer, MK Iyengar, PR Parida US Patent 9,445,529, 2016 | 33 | 2016 |
Srinath EkkadDepartment Head and RJ Reynolds Professor, NC State在 ncsu.edu 的电子邮件经过验证
