| Electroreduction of dioxygen for fuel-cell applications: materials and challenges AA Gewirth, MS Thorum Inorganic chemistry 49 (8), 3557-3566, 2010 | 802 | 2010 |
| Poisoning the oxygen reduction reaction on carbon-supported Fe and Cu electrocatalysts: evidence for metal-centered activity MS Thorum, JM Hankett, AA Gewirth The Journal of Physical Chemistry Letters 2 (4), 295-298, 2011 | 330 | 2011 |
| Oxygen reduction activity of a copper complex of 3, 5‐diamino‐1, 2, 4‐triazole supported on carbon black MS Thorum, J Yadav, AA Gewirth Angewandte Chemie International Edition 48 (1), 165-167, 2009 | 207 | 2009 |
| Direct, electrocatalytic oxygen reduction by laccase on anthracene-2-methanethiol-modified gold MS Thorum, CA Anderson, JJ Hatch, AS Campbell, NM Marshall, ... The journal of physical chemistry letters 1 (15), 2251-2254, 2010 | 116 | 2010 |
| A carbon-supported copper complex of 3, 5-diamino-1, 2, 4-triazole as a cathode catalyst for alkaline fuel cell applications FR Brushett, MS Thorum, NS Lioutas, MS Naughton, C Tornow, ... Journal of the American Chemical Society 132 (35), 12185-12187, 2010 | 114 | 2010 |
| In situ electrochemical X-ray absorption spectroscopy of oxygen reduction electrocatalysis with high oxygen flux EM Erickson, MS Thorum, R Vasić, NS Marinković, AI Frenkel, AA Gewirth, ... Journal of the American Chemical Society 134 (1), 197-200, 2012 | 96 | 2012 |
| Vanadium 7, 7, 8, 8-tetracyano-p-quinodimethane (V [TCNQ] 2)-based magnets EB Vickers, TD Selby, MS Thorum, ML Taliaferro, JS Miller Inorganic chemistry 43 (20), 6414-6420, 2004 | 96 | 2004 |
| Room‐Temperature Organic‐Based Magnet (Tc≈ 50° C) Containing Tetracyanobenzene and Hexacarbonylvanadate (− I) ML Taliaferro, MS Thorum, JS Miller Angewandte Chemie International Edition 45 (32), 5326-5331, 2006 | 51 | 2006 |
| Effect of pH and azide on the oxygen reduction reaction with a pyrolyzed Fe phthalocyanine catalyst JL Oberst, MS Thorum, AA Gewirth The Journal of Physical Chemistry C 116 (48), 25257-25261, 2012 | 30 | 2012 |
| Advanced metallization scheme for 3× 50µm via middle TSV and beyond S Van Huylenbroeck, Y Li, N Heylen, K Croes, G Beyer, E Beyne, M Brouri, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 66-72, 2015 | 22 | 2015 |
| Solvent enhancement of the magnetic ordering temperature (Tc) of the room temperature V [TCNE] x· S (S= solvent, TCNE= tetracyanoethylene; x∼ 2) magnet MS Thorum, KI Pokhodnya, JS Miller Polyhedron 25 (9), 1927-1930, 2006 | 18 | 2006 |
| Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte TA Spurlin, CL Merrill, L Huang, M Thorum, L Brogan, JE Duncan, ... US Patent 9,816,196, 2017 | 14 | 2017 |
| TSV bath evaluation using field versus feature contrast L Brogan, ST Mayer, M Thorum, J Richardson, DW Porter, H Fu US Patent 9,689,083, 2017 | 14 | 2017 |
| Alkaline pretreatment for electroplating M Thorum US Patent 9,435,049, 2016 | 13 | 2016 |
| Advanced integrated metallization enables 3D-IC TSV scaling J Yu, S Gopinath, P Nalla, M Thorum, L Schloss, DM Anjos, P Meshram, ... 2015 IEEE International Interconnect Technology Conference and 2015 IEEE …, 2015 | 12 | 2015 |
| Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias MS Thorum, ST Mayer US Patent 9,617,648, 2017 | 11 | 2017 |
| Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter Y Li, S Van Huylenbroeck, P Roussel, M Brouri, S Gopinath, DM Anjos, ... Microelectronic Engineering 156, 37-40, 2016 | 11 | 2016 |
| An alternative approach to backside via reveal (BVR) for a via-middle through-Silicon via (TSV) flow J Yu, S Detterbeck, CP Lee, P Meshram, T Mountsier, L Wei, Q Xu, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 551-554, 2015 | 6 | 2015 |
| Freezing a sacrificial material in forming a semiconductor MS Thorum US Patent 10,957,530, 2021 | 3 | 2021 |
| Using sacrificial solids in semiconductor processing MS Thorum, GS Sandhu US Patent 10,784,101, 2020 | 3 | 2020 |
