Gold nanoisland agglomeration upon the substrate assisted chemical etching based on thermal annealing process P Potejanasak, S Duangchan Crystals 10 (6), 533, 2020 | 13 | 2020 |
The silicon on diamond structure by low-temperature bonding technique S Duangchan, Y Uchikawa, Y Koishikawa, B Akiyoshi, K Nakagawa, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 187-192, 2015 | 4 | 2015 |
Fabrication of silicon-on-diamond substrate with an ultrathin SiO2 bonding layer M Nagata, R Shirahama, S Duangchan, A Baba Japanese Journal of Applied Physics 57 (6S1), 06HJ08, 2018 | 3 | 2018 |
Reduced operating temperature of active layer Si covered by nanocrystalline diamond film S Duangchan, Y Koishikawa, R Shirahama, K Oishi, A Baba, ... Journal of Materials Science: Materials in Electronics 28, 617-624, 2017 | 3 | 2017 |
Influential factors in low-temperature direct bonding of silicon dioxide R Shirahama, S Duangchan, Y Koishikawa, A Baba 2015 International 3D Systems Integration Conference (3DIC), TS8. 16.1-TS8. 16.5, 2015 | 1 | 2015 |
The Benefits of Using SiN as a Buried Oxide in Germanium-On-Insulator Substrate S Duangchan, K Yamamoto, D Wang, H Nakashima, A Baba 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2020 | | 2020 |
SiN used as a Stressor in Germanium-On-Insulator Substrate S Duangchan, K Yamamoto, D Wang, H Nakashima, A Baba 2019 International 3D Systems Integration Conference (3DIC), 1-5, 2019 | | 2019 |
スパッタエッチングによる表面平坦化の活性化接合への応用 永田将大, 白浜亮弥 「センサ・マイクロマシンと応用システム」 シンポジウム論文集 電気学会センサ・マイクロマシン部 …, 2017 | | 2017 |
表面活性化接合における接合面積拡大のためのイオン条件の検討 白浜亮弥, 村山智紀, 濱田爽志, 馬場昭好 「センサ・マイクロマシンと応用システム」 シンポジウム論文集 電気学会センサ・マイクロマシン部 …, 2016 | | 2016 |