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Sethavut DUANGCHAN
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引用次数
引用次数
年份
Gold nanoisland agglomeration upon the substrate assisted chemical etching based on thermal annealing process
P Potejanasak, S Duangchan
Crystals 10 (6), 533, 2020
132020
The silicon on diamond structure by low-temperature bonding technique
S Duangchan, Y Uchikawa, Y Koishikawa, B Akiyoshi, K Nakagawa, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 187-192, 2015
42015
Fabrication of silicon-on-diamond substrate with an ultrathin SiO2 bonding layer
M Nagata, R Shirahama, S Duangchan, A Baba
Japanese Journal of Applied Physics 57 (6S1), 06HJ08, 2018
32018
Reduced operating temperature of active layer Si covered by nanocrystalline diamond film
S Duangchan, Y Koishikawa, R Shirahama, K Oishi, A Baba, ...
Journal of Materials Science: Materials in Electronics 28, 617-624, 2017
32017
Influential factors in low-temperature direct bonding of silicon dioxide
R Shirahama, S Duangchan, Y Koishikawa, A Baba
2015 International 3D Systems Integration Conference (3DIC), TS8. 16.1-TS8. 16.5, 2015
12015
The Benefits of Using SiN as a Buried Oxide in Germanium-On-Insulator Substrate
S Duangchan, K Yamamoto, D Wang, H Nakashima, A Baba
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 1-3, 2020
2020
SiN used as a Stressor in Germanium-On-Insulator Substrate
S Duangchan, K Yamamoto, D Wang, H Nakashima, A Baba
2019 International 3D Systems Integration Conference (3DIC), 1-5, 2019
2019
スパッタエッチングによる表面平坦化の活性化接合への応用
永田将大, 白浜亮弥
「センサ・マイクロマシンと応用システム」 シンポジウム論文集 電気学会センサ・マイクロマシン部 …, 2017
2017
表面活性化接合における接合面積拡大のためのイオン条件の検討
白浜亮弥, 村山智紀, 濱田爽志, 馬場昭好
「センサ・マイクロマシンと応用システム」 シンポジウム論文集 電気学会センサ・マイクロマシン部 …, 2016
2016
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