| Analysis of Microbump Overheads for 2.5 D Disintegrated Design P Ehrett, V Goyal, O Matthews, R Das, T Austin, V Bertacco UMich. Ann Arbor Tech. Rep. CSE-TR-002-17, 2017 | 12 | 2017 |
| SiPterposer: A Fault-Tolerant Substrate for Flexible System-in-Package Design P Ehrett, T Austin, V Bertacco 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE), 510-515, 2019 | 11 | 2019 |
| SWAN: mitigating hardware trojans with design ambiguity T Linscott, P Ehrett, V Bertacco, T Austin Proceedings of the International Conference on Computer-Aided Design, 91, 2018 | 9 | 2018 |
| Chopin: Composing Cost-Effective Custom Chips with Algorithmic Chiplets P Ehrett, T Austin, V Bertacco 2021 IEEE 39th International Conference on Computer Design (ICCD), 395-399, 2021 | 7 | 2021 |
| A Defense-Inspired Benchmark Suite P Ehrett, N Block, B Schaefer, A Berding, JP Koenig, P Srinivasan, ... 2021 IEEE International Symposium on Performance Analysis of Systems and …, 2021 | | 2021 |
Todd AustinProfessor of Computer Science and Electrical Engineering, University of Michigan在 umich.edu 的电子邮件经过验证
