Cu-content dependence of shape memory characteristics in Ti–Ni–Cu alloys TH Nam, T Saburi, K Shimizu Materials Transactions, JIM 31 (11), 959-967, 1990 | 513 | 1990 |
Long-term clinical study and multiscale analysis of in vivo biodegradation mechanism of Mg alloy JW Lee, HS Han, KJ Han, J Park, H Jeon, MR Ok, HK Seok, JP Ahn, ... Proceedings of the National Academy of Sciences 113 (3), 716-721, 2016 | 419 | 2016 |
Shape memory characteristics and lattice deformation in Ti–Ni–Cu alloys TH Nam, T Saburi, Y Nakata, K Shimizu Materials Transactions, JIM 31 (12), 1050-1056, 1990 | 264 | 1990 |
Discharge mechanism of MoS2 for sodium ion battery: Electrochemical measurements and characterization J Park, JS Kim, JW Park, TH Nam, KW Kim, JH Ahn, G Wang, HJ Ahn Electrochimica Acta 92, 427-432, 2013 | 243 | 2013 |
Shape memory properties of Ti–Nb–Mo biomedical alloys Y Al-Zain, HY Kim, H Hosoda, TH Nam, S Miyazaki Acta Materialia 58 (12), 4212-4223, 2010 | 240 | 2010 |
Role of subnano-, nano-and submicron-surface features on osteoblast differentiation of bone marrow mesenchymal stem cells D Khang, J Choi, YM Im, YJ Kim, JH Jang, SS Kang, TH Nam, J Song, ... Biomaterials 33 (26), 5997-6007, 2012 | 237 | 2012 |
Discharge reaction mechanism of room-temperature sodium–sulfur battery with tetra ethylene glycol dimethyl ether liquid electrolyte H Ryu, T Kim, K Kim, JH Ahn, T Nam, G Wang, HJ Ahn Journal of Power Sources 196 (11), 5186-5190, 2011 | 224 | 2011 |
Discharge behavior of lithium/sulfur cell with TEGDME based electrolyte at low temperature HS Ryu, HJ Ahn, KW Kim, JH Ahn, KK Cho, TH Nam, JU Kim, GB Cho Journal of Power Sources 163 (1), 201-206, 2006 | 191 | 2006 |
Shape Memory Characteristics Associated with the B2\ightleftarrowsB19 and B19\ightleftarrowsB19′ Transformations in a Ti-40Ni-10Cu (at.%) Alloy TH Nam, T Saburi, Y Kawamura, K Shimizu Materials Transactions, JIM 31 (4), 262-269, 1990 | 180 | 1990 |
Self-discharge characteristics of lithium/sulfur batteries using TEGDME liquid electrolyte HS Ryu, HJ Ahn, KW Kim, JH Ahn, KK Cho, TH Nam Electrochimica acta 52 (4), 1563-1566, 2006 | 165 | 2006 |
The discharge properties of Na/Ni3S2 cell at ambient temperature JS Kim, HJ Ahn, HS Ryu, DJ Kim, GB Cho, KW Kim, TH Nam, JH Ahn Journal of Power Sources 178 (2), 852-856, 2008 | 140 | 2008 |
Anomalous temperature dependence of the superelastic behavior of Ti–Nb–Mo alloys Y Al-Zain, HY Kim, T Koyano, H Hosoda, TH Nam, S Miyazaki Acta Materialia 59 (4), 1464-1473, 2011 | 119 | 2011 |
Analysis on migration and activation of live macrophages on transparent flat and nanostructured titanium S Lee, J Choi, S Shin, YM Im, J Song, SS Kang, TH Nam, TJ Webster, ... Acta biomaterialia 7 (5), 2337-2344, 2011 | 116 | 2011 |
Functionally graded shape memory alloys: Design, fabrication and experimental evaluation BS Shariat, Q Meng, AS Mahmud, Z Wu, R Bakhtiari, J Zhang, ... Materials & design 124, 225-237, 2017 | 115 | 2017 |
A new concept of isolation bearings for highway steel bridges using shape memory alloys E Choi, T Nam, BS Cho Canadian Journal of Civil Engineering 32 (5), 957-967, 2005 | 110 | 2005 |
Gradient anneal of functionally graded NiTi AS Mahmud, Y Liu, T Nam Smart Materials and Structures 17 (1), 015031, 2008 | 108 | 2008 |
Functionally graded NiTi strips prepared by laser surface anneal Q Meng, Y Liu, H Yang, BS Shariat, T Nam Acta Materialia 60 (4), 1658-1668, 2012 | 105 | 2012 |
The electrochemical properties of copper sulfide as cathode material for rechargeable sodium cell at room temperature JS Kim, DY Kim, GB Cho, TH Nam, KW Kim, HS Ryu, JH Ahn, HJ Ahn Journal of Power Sources 189 (1), 864-868, 2009 | 101 | 2009 |
Effect of pseudoelastic cycling on the Clausius–Clapeyron relation for stress-induced martensitic transformation in NiTi Y Liu, A Mahmud, F Kursawe, TH Nam Journal of Alloys and Compounds 449 (1-2), 82-87, 2008 | 97 | 2008 |
Martensitic transformation and shape memory properties of Ti–Ta–Sn high temperature shape memory alloys HY Kim, T Fukushima, PJS Buenconsejo, T Nam, S Miyazaki Materials Science and Engineering: A 528 (24), 7238-7246, 2011 | 88 | 2011 |