关注
Ichihiko Toyoda
Ichihiko Toyoda
Professor, Saga University
在 cc.saga-u.ac.jp 的电子邮件经过验证
标题
引用次数
引用次数
年份
Compact and broad-band three-dimensional MMIC balun
K Nishikawa, I Toyoda, T Tokumitsu
IEEE transactions on microwave theory and techniques 47 (1), 96-98, 1999
981999
5.8-GHz stacked differential rectenna suitable for large-scale rectenna arrays with DC connection
T Matsunaga, E Nishiyama, I Toyoda
IEEE Transactions on Antennas and Propagation 63 (12), 5944-5949, 2015
972015
Multilayer MMIC branch-line coupler and broad-side coupler
I Toyoda, T Hirota, T Hiraoka, T Tokumitsu
IEEE 1992 Microwave and Millimeter-Wave Monolithic Circuits Symposium Digest …, 1992
821992
Three-dimensional passive circuit technology for ultra-compact MMICs
H Hirano, K Nishikawa, I Toyoda, S Aoyama, S Sugitani, K Yamasaki
IEEE Transactions on Microwave Theory and Techniques 43 (12), 2845-2850, 1995
801995
High frequency masterslice monolithic integrated circuit
I Toyoda, T Tokumitsu, K Nishikawa, K Kamogawa
US Patent 5,739,560, 1998
731998
Highly integrated three-dimensional MMIC single-chip receiver and transmitter
I Toyoda, T Tokumitsu, M Aikawa
IEEE transactions on microwave theory and techniques 44 (12), 2340-2346, 1996
711996
A low-voltage, high-power T/R-switch MMIC using LC resonators
T Tokumitsu, I Toyoda, M Aikawa
IEEE transactions on Microwave Theory and Techniques 43 (5), 997-1003, 1995
701995
5.8-GHz series/parallel connected rectenna array using expandable differential rectenna units
T Sakamoto, Y Ushijima, E Nishiyama, M Aikawa, I Toyoda
IEEE transactions on antennas and propagation 61 (9), 4872-4875, 2013
692013
Miniaturized Wilkinson power divider using three-dimensional MMIC technology
K Nishikawa, T Tokumitsu, I Toyoda
IEEE microwave and guided wave letters 6 (10), 372-374, 1996
551996
Three-dimensional masterslice MMIC on Si substrate
I Toyoda, K Nishikawa, T Tokumitsu, K Kamogawa, C Yamaguchi, ...
IEEE transactions on microwave theory and techniques 45 (12), 2524-2530, 1997
461997
5.8-GHz integrated differential rectenna unit using both-sided MIC technology with design flexibility
Y Ushijima, T Sakamoto, E Nishiyama, M Aikawa, I Toyoda
IEEE transactions on antennas and propagation 61 (6), 3357-3360, 2013
452013
Reference antenna model with side lobe for TG3c evaluation
I Toyoda
IEEE 802.15-06-0474-00-003c, 2006
442006
Three-dimensional MMIC technology for low-cost millimeter-wave MMICs
K Nishikawa, K Kamogawa, B Piernas, M Tokumitsu, S Sugitani, I Toyoda, ...
IEEE Journal of Solid-State Circuits 36 (9), 1351-1359, 2001
442001
Multilayer transmission line using ground metal with slit, and hybrid using the transmission line
K Nishikawa, I Toyoda, T Tokumitsu, K Kamogawa
US Patent 5,634,208, 1997
401997
60GHz monolithic LTCC module for wireless communication systems
T Seki, K Nishikawa, Y Suzuki, I Toyoda, K Tsunekawa
2006 European Conference on Wireless Technology, 376-379, 2006
392006
A novel high-Q and wide-frequency-range inductor using Si 3-D MMIC technology
K Kamogawa, K Nishikawa, I Toyoda, T Tokumitsu, M Tanaka
IEEE microwave and guided wave letters 9 (1), 16-18, 1999
361999
Miniaturized millimeter-wave masterslice 3-D MMIC amplifier and mixer
K Nishikawa, K Kamogawa, R Inoue, K Onodera, T Tokumitsu, M Tanaka, ...
IEEE transactions on microwave theory and techniques 47 (9), 1856-1862, 1999
341999
A 4-element MIMO antenna with orthogonal circular polarization for sub-6 GHz 5G cellular applications
S Chakraborty, MA Rahman, MA Hossain, AT Mobashsher, E Nishiyama, ...
SN Applied Sciences 2, 1-13, 2020
332020
A compact V-band 3-D MMIC single-chip down-converter using photosensitive BCB dielectric film
K Nishikawa, S Sugitani, K Kamogawa, T Tokumitsu, I Toyoda, M Tanaka
IEEE Transactions on Microwave Theory and Techniques 47 (12), 2512-2518, 1999
331999
Three-dimensional MMIC technology for multifunction integration and its possible application to masterslice MMIC
T Tokumitsu, K Nishikawa, K Kamogawa, I Toyoda, M Aikawa
IEEE 1996 Microwave and Millimeter-Wave Monolithic Circuits Symposium …, 1996
311996
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