| A temperature-dependent thermal model of IGBT modules suitable for circuit-level simulations R Wu, H Wang, KB Pedersen, K Ma, P Ghimire, F Iannuzzo, F Blaabjerg IEEE Transactions on Industry Applications 52 (4), 3306-3314, 2016 | 154 | 2016 |
| Dynamic modeling method of electro-thermo-mechanical degradation in IGBT modules KB Pedersen, K Pedersen IEEE Transactions on Power Electronics 31 (2), 975-986, 2015 | 96 | 2015 |
| A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application P Ghimire, KB Pedersen, AR de Vega, B Rannestad, S Munk-Nielsen, ... CIPS 2014; 8th International Conference on Integrated Power Electronics …, 2014 | 51 | 2014 |
| Bond wire lift-off in IGBT modules due to thermomechanical induced stress KB Pedersen, K Pedersen 2012 3rd IEEE International Symposium on Power Electronics for Distributed …, 2012 | 49 | 2012 |
| Embedded very fast switching module for SiC power MOSFETs G Feix, E Hoene, O Zeiter, K Pedersen Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015 | 42 | 2015 |
| Degradation assessment in IGBT modules using four-point probing approach KB Pedersen, PK Kristensen, V Popok, K Pedersen IEEE Transactions on Power Electronics 30 (5), 2405-2412, 2014 | 42 | 2014 |
| Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules KB Pedersen, PK Kristensen, V Popok, K Pedersen Microelectronics Reliability 53 (9-11), 1422-1426, 2013 | 33 | 2013 |
| Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules KB Pedersen, D Benning, PK Kristensen, VN Popok, K Pedersen Journal of Materials Science: Materials in Electronics 25, 2863-2871, 2014 | 31 | 2014 |
| Test setup for accelerated test of high power IGBT modules with online monitoring of Vceand Vfvoltage during converter operation AR de Vega, P Ghimire, KB Pedersen, I Trintis, S Beczckowski, ... 2014 International Power Electronics Conference (IPEC-Hiroshima 2014-ECCE …, 2014 | 31 | 2014 |
| Online chip temperature monitoring using υce-load current and IR thermography P Ghimire, KB Pedersen, I Trintis, B Rannestad, S Munk-Nielsen 2015 IEEE Energy Conversion Congress and Exposition (ECCE), 6602-6609, 2015 | 24 | 2015 |
| Vce as early indicator of IGBT module failure mode KB Pedersen, PK Kristensen, K Pedersen, C Uhrenfeldt, S Munk-Nielsen 2017 IEEE International Reliability Physics Symposium (IRPS), FA-1.1-FA-1.6, 2017 | 23 | 2017 |
| Effects of thermal cycling on aluminum metallization of power diodes M Brincker, KB Pedersen, PK Kristensen, VN Popok Microelectronics Reliability 55 (9-10), 1988-1991, 2015 | 22 | 2015 |
| Passive thermal cycling of power diodes under controlled atmospheric conditions-effects on metallization degradation M Brincker, KB Pedersen, PK Kristensen, V Popok CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016 | 19 | 2016 |
| Comprehensive physical analysis of bond wire interfaces in power modules VN Popok, KB Pedersen, PK Kristensen, K Pedersen Microelectronics Reliability 58, 58-64, 2016 | 16 | 2016 |
| Degradation mapping in high power IGBT modules using four-point probing KB Pedersen, LH Østergaard, P Ghimire, V Popok, K Pedersen Microelectronics Reliability 55 (8), 1196-1204, 2015 | 16 | 2015 |
| AR d. Vega, B. Rannestad, S. Munk-Nielsen, and PB Thogersen," A real time measurement of junction temperature variation in high power IGBT modules for wind power converter … P Ghimire, KB Pedersen Integrated Power Systems (CIPS), 2014 8th International Conference on, 1-6, 2014 | 16 | 2014 |
| Comparative study of wire bond degradation under power and mechanical accelerated tests VN Popok, S Buhrkal-Donau, B Czerny, G Khatibi, H Luo, F Iannuzzo, ... Journal of Materials Science: Materials in Electronics 30, 17040-17045, 2019 | 15 | 2019 |
| Wire bond degradation under thermo-and pure mechanical loading KB Pedersen, DA Nielsen, B Czerny, G Khatibi, F Iannuzzo, VN Popok, ... Microelectronics Reliability 76, 373-377, 2017 | 15 | 2017 |
| Degradation evolution in high power IGBT modules subjected to sinusoidal current load KB Pedersen, LH Østergaard, PK Kristensen, P Ghimire, VN Popok, ... Journal of Materials Science: Materials in Electronics 27, 1938-1945, 2016 | 15 | 2016 |
| Comparative study of Al metallization degradation in power diodes under passive and active thermal cycling M Brincker, KB Pedersen, PK Kristensen, VN Popok IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 11 | 2018 |
