关注
Paweł Górecki
Paweł Górecki
Uniwersytet Morski w Gdyni
在 we.am.gdynia.pl 的电子邮件经过验证
标题
引用次数
引用次数
年份
Compact thermal models of semiconductor devices–a review
K Górecki, J Zarębski, P Górecki, P Ptak
International Journal of Electronics and Telecommunications 65 (2), 151-158, 2019
612019
Measurements of parameters of the thermal model of the IGBT module
K Górecki, P Górecki, J Zarębski
IEEE Transactions on Instrumentation and Measurement 68 (12), 4864-4875, 2019
572019
Nonlinear compact thermal model of the IGBT dedicated to SPICE
K Górecki, P Górecki
IEEE Transactions on Power Electronics 35 (12), 13420-13428, 2020
512020
The Analysis Of Accuracy Of Selected Methods Of Measuring The Thermal Resistance Of IGBTs
K Górecki, P Górecki
Metrology and Measurement Systems 22 (3), 455-464, 2015
432015
Accurate Computation of IGBT Junction Temperature in PLECS
P Górecki, D Wojciechowski
IEEE Transactions on Electron Devices 67 (7), 2865-2871, 2020
282020
Modelling dynamic characteristics of the IGBT with thermal phenomena taken into account
K Górecki, P Górecki
Microelectronics International 34 (3), 160-164, 2017
272017
Methods of Fast Analysis of DC–DC Converters—A Review
P Górecki, K Górecki
Electronics 10 (23), 2920, 2021
232021
Modelling solar cells with thermal phenomena taken into account
K Górecki, P Górecki, K Paduch
Journal of Physics: Conference Series 494 (1), 012007, 2014
232014
Measurements and computations of internal temperatures of the IGBT and the diode situated in the common case
P Górecki, K Gorecki
Electronics 10 (2), 210, 2021
222021
Modelling the influence of self-heating on characteristics of IGBTs
K Górecki, P Górecki
2014 Proceedings of the 21st International Conference Mixed Design of …, 2014
192014
Modelling the temperature influence on dc characteristics of the IGBT
P Górecki, K Górecki, J Zarębski
Microelectronics Reliability 79, 96-103, 2017
172017
Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints
A Skwarek, B Illés, P Górecki, A Pietruszka, J Tarasiuk, T Hurtony
Journal of Materials Research and Technology 22, 403-412, 2023
162023
Porównanie właściwości eksploatacyjnych wybranych typów lamp LED
K Górecki, K Górecka, P Górecki
Przegląd Elektrotechniczny 88 (11a), 111-114, 2012
162012
The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)
A Pietruszka, P Górecki, S Wroński, B Illés, A Skwarek
Applied Sciences 11 (12), 5583, 2021
142021
Analysis of the Usefulness Range of the Averaged Electrothermal Model of a Diode–Transistor Switch to Compute the Characteristics of the Boost Converter
P Górecki, K Górecki
Energies 14 (1), 154, 2020
142020
Modelling a Switching Process of IGBTs with Influence of Temperature Taken into Account
P Górecki, K Górecki
Energies 12 (10), 1894, 2019
142019
Modelling Properties of an Alkaline Electrolyser
K Górecki, M Górecka, P Górecki
Energies 13 (12), 3073, 2020
122020
Electrothermal Averaged Model of a Diode–IGBT Switch for a Fast Analysis of DC–DC Converters
P Górecki
IEEE Transactions on Power Electronics 37 (11), 13003-13013, 2022
112022
Accurate Circuit-Level Modelling of IGBTs with Thermal Phenomena Taken into Account
P Górecki, K Górecki, J Zarębski
Energies 14 (9), 2372, 2021
112021
Thermal Parameters of Monocrystalline GaN Schottky Diodes
P Górecki, K Górecki, R Kisiel, M Myśliwiec
IEEE Transactions on Electron Devices 66 (5), 2132-2138, 2019
112019
系统目前无法执行此操作,请稍后再试。
文章 1–20