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Qais Qasaimeh
Qais Qasaimeh
PhD Stdudent at Auburn University
在 auburn.edu 的电子邮件经过验证
标题
引用次数
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Investigating the Evolution of Creep Properties during Thermal Cycling of Homogeneous Lead-Free Solder Joints
MEA Belhadi, A Alahmer, Q Qasaimeh, A Alakayleh, S Alavi
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023
12023
Predicting the Life of the Solder Joints in Electronic Assemblies using Physics-informed Data-driven Methodology
Q Qasaimeh, J Liu, A Qasaimeh, J Evans
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023
12023
Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling
MEA Belhadi, X Wei, Q Qasaimeh, P Vyas, R Zhao, E Hmasha, D Ali, ...
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022
12022
Physics-Informed Machine Learning for Solder Design and Reliability Prediction for Electronics
J Liu, Q Qasaimeh
2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific), 1-7, 2024
2024
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