| Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors RS Sivasubramony, N Adams, M Alhendi, GS Khinda, MZ Kokash, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 896-903, 2018 | 22 | 2018 |
| Effects of oven and laser sintering parameters on the electrical resistance of ijp nano-silver traces on mesoporous pet before and during fatigue cycling GS Khinda, MZ Kokash, M Alhendi, M Yadav, JP Lombardi, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1946-1951, 2019 | 18 | 2019 |
| Fatigue cycling of electrical interconnects dispensed on flexible substrate M Alhendi, JP Lombardi III, GS Khinda, MZ Kokash, DL Weerawarne, ... International Symposium on Microelectronics 2018 (1), 000543-000548, 2018 | 12 | 2018 |
| Fatigue testing of copper nanoparticle-based joints and bonds RS Sivasubramony, MZ Kokash, S Thekkut, N Shahane, P Thompson, ... Journal of Electronic Packaging 144 (1), 011007, 2022 | 9 | 2022 |
| Assessing the reliability of high temperature solder alternatives MZ Kokash, RS Sivasubramony, JLT Cuevas, AF Zamudio, P Borgesen, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1987-1995, 2017 | 9 | 2017 |
| Optimization in Pharmaceutical Supply Chain Inventory management for Disaster Planning L He, JLT Cuevas, MZ Kokash, EA Banimustafa, MT Khasawneh IIE Annual Conference. Proceedings, 1583-1588, 2017 | 8 | 2017 |
| Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds S Thekkut, MZ Kokash, RS Sivasubramony, Y Kawana, K Mirpuri, ... Journal of Electronic Packaging 144 (3), 031009, 2022 | 6 | 2022 |
| Deformation and damage of copper and nano copper based joints MZ Kokash State University of New York at Binghamton, 2015 | 6 | 2015 |
| Fatigue behaviour of inkjet-printed silver interconnects on silica-coated mesoporous flexible PET substrate GS Khinda, MZ Kokash, M Alhendi, B Garakani, NC Stoffel, P Borgesen, ... Flexible and Printed Electronics 7 (1), 015011, 2022 | 4 | 2022 |
| Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending and Tension With Different Amplitudes RS Sivasubramony, M Alhendi, MZ Kokash, M Yadav, A Raj, S Thekkut, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1225-1233, 2020 | 3 | 2020 |
| Assessing the reliability of fused/sintered Nano-particles MZ Kokash State University of New York at Binghamton, 2019 | 2 | 2019 |
| Printed Circuit Board Reliability Improvement Using Total Quality Management Techniques MZ Kokash, T Alghoul, S Al-Hihi, M Alhendi, C Greene IIE Annual Conference. Proceedings, 455-460, 2018 | | 2018 |
