| Collective laser‐assisted bonding process for 3D TSV integration with NCP W Alves Braganca, YS Eom, KS Jang, SH Moon, HC Bae, KS Choi Etri Journal 41 (3), 396-407, 2019 | 28 | 2019 |
| Development of stacking process for 3D TSV (through silicon via) structure using laser KS Choi, WA Braganca, KS Jang, HC Bae, YS Eom International Symposium on Microelectronics 2017 (1), 000067-000071, 2017 | 20 | 2017 |
| Interconnection process using laser and hybrid underfill for LED array module on PET substrate KS Choi, WAB Junior, KS Jang, SH Moon, HC Bae, YS Eom, MK Cho, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1567-1573, 2018 | 17 | 2018 |
| Method of fabricating a semiconductor package KS Choi, Y Eom, KS Jang, SH Moon, HC Bae, I Jeong, WAB Junior US Patent 10,636,761, 2020 | 11 | 2020 |
| Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test WA Braganca, YS Eom, J Son, KS Jang, HC Bae, SH Moon, KS Choi 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-8, 2017 | 8 | 2017 |
| Characterization of laser beams: theory and application in laser-assisted bonding process WA Braganca Jr, KO Kim Optical Engineering 60 (6), 060801-060801, 2021 | 7 | 2021 |
| Development of a laser-assisted bonding process for a flip-chip die with backside metallization WA Braganca, K KyungOe, K YoungCheol 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 68-72, 2020 | 6 | 2020 |
| Die-beam alignment for laser-assisted bonding WA Braganca, KO Kim, T Lee US Patent 11,929,334, 2024 | 1 | 2024 |
| Semiconductor device and method of controlling warpage during LAB WA Braganca, KO Kim US Patent 11,688,718, 2023 | 1 | 2023 |
| Semiconductor device and method of controlling warpage during LAB WA Braganca, KO Kim US Patent 12,074,135, 2024 | | 2024 |
| Die-Beam Alignment for Laser-Assisted Bonding WA Braganca, KO Kim, T Lee US Patent App. 18/429,418, 2024 | | 2024 |
| Region-of-interest positioning for laser-assisted bonding WA Braganca, KO Kim US Patent 11,817,357, 2023 | | 2023 |
| Thermally Enhanced FCBGA Package KO Kim, WA Braganca, D Park US Patent App. 18/305,913, 2023 | | 2023 |
| Thermally enhanced FCBGA package KO Kim, WA Braganca, D Park US Patent 11,670,563, 2023 | | 2023 |
| Advanced Die-Beam Alignment Method for Laser-Assisted Bonding WA Braganca Jr, K KyungOe International Symposium on Microelectronics 2020 (1), 000106-000112, 2020 | | 2020 |
