| Effect of sintering temperature on the fatigue life of additively printed electronics during cyclic bending P Lall, J Narangaparambil, B Leever, S Miller 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 20 | 2019 |
| Development of test protocols for the flexible substrates in wearable applications P Lall, J Narangaparambil, A Abrol, B Leever, J Marsh 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 19 | 2018 |
| Process Recipes for Additively Printed Copper-Ink Flexible Circuits using Direct Write Methods P Lall, J Narangaparambil, K Schulze, C Hill 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 14 | 2021 |
| Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment P Lall, J Narangaparambil, K Schulze, S Miller International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 12 | 2021 |
| Flexure and twist test reliability assurance of flexible electronics P Lall, J Narangaparambil, B Leever, S Miller Journal of Electronic Packaging 142 (3), 031121, 2020 | 10 | 2020 |
| Print process development for Ag-ink thermoformable conductive traces utilizing direct write technique for in-mold printed electronics P Lall, MG Sarwar, J Narangaparambil, S Miller 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 9 | 2023 |
| Sintering process conditions for additive printing of multi-layer circuitry aerosol-jet process in conjunction with nanoparticle ink P Lall, J Narangaparambil, V Soni, S Miller 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 8 | 2020 |
| Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications P Lall, J Narangaparambil, S Miller International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 6 | 2022 |
| Accuracy, Hysteresis and Extended Time Stability of Additively Printed Temperature and Humidity Sensors P Lall, K Goyal, J Narangaparambil 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1070-1080, 2020 | 6 | 2020 |
| Sustainable Silver Ink Process Study on Low-Temperature Flexible Substrates P Lall, F Musa, J Narangaparambil, S Miller 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical …, 2023 | 5 | 2023 |
| Printed flexible LC filter using the micro-dispensing technique using silver conductive pasted and ECA for component attachment P Lall, J Narangaparambil, K Schulze, S Miller 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 5 | 2021 |
| Correlation of accelerated tests with human body measurements for flexible electronics in wearable applications P Lall, T Thomas, J Narangaparambil, K Goyal, H Jang, V Yadav, W Liu 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
| Effect of use parameters on fatigue-life of flexible substrates under bending loads P Lall, J Narangaparatnbil, B Leever, S Miller 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 5 | 2019 |
| Performance of Component Interconnection Methods on Direct Write Additive Silver Circuits P Lall, J Narangaparambil, S Miller 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 4 | 2022 |
| Interconnection of Passive Components using Printed Aerosol-Jet Traces P Lall, J Narangaparambil, K Schulze, S Miller 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 4 | 2021 |
| Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications P Lall, J Narangaparambil, S Miller 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1172-1183, 2022 | 3 | 2022 |
| Influence of Component Interconnect with Printed Copper Circuits on Realized Mechanical and Electrical Characteristics in FHE Applications P Lall, J Narangaparambil, S Miller 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 2 | 2022 |
| Flexible encapsulation process-property relationships for flexible hybrid electronics P Lall, P Choudhury, J Narangaparambil, S Miller 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1490-1499, 2021 | 2 | 2021 |
| Process Development for Printing Z-Axis Interconnects in Multilayered Flexible Substrates P Lall, V Soni, J Narangaparambil, K Schulze, S Miller 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 2 | 2020 |
| Process Development for Additive Fabrication of Z-Axis Interconnects In Multilayer Circuits P Lall, N Kothari, K Goyal, J Narangaparambil, S Miller 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 2 | 2020 |
