关注
Igor Kovtun / Ігор Іванович Ковтун
Igor Kovtun / Ігор Іванович Ковтун
Khmelnytskyi National University; Хмельницький національний університет
在 khmnu.edu.ua 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Effects of the strain transmission from the main board to the installed electronic components
І Kovtun, J Boiko, S Petrashchuk, G Baurienė, K Pilkauskas
Kaunas university of technology, 2016
302016
Nondestructive strength diagnostics of solder joints on printed circuit boards
I Kovtun, J Boiko, S Petrashchuk
2017 International conference on information and telecommunication …, 2017
292017
Productivity of telecommunication systems with modified signal-code constructions
J Boiko, I Kovtun, S Petrashchuk
2017 4th International Scientific-Practical Conference Problems of …, 2017
242017
Theory and practice of vibration analysis in electronic packages
I Kovtun, J Boiko, S Petrashchuk, T Kałaczyński
MATEC Web of Conferences 182, 02015, 2018
222018
Quality assessment of synchronization devices in telecommunication
J Boiko, O Eromenko, I Kovtun, S Petrashchuk
2019 IEEE 39th International Conference on Electronics and Nanotechnology …, 2019
182019
Vibration transmission in electronic packages having structurally complex design
J Boiko, I Kovtun, S Petrashchuk
2017 IEEE First Ukraine Conference on Electrical and Computer Engineering …, 2017
172017
Improving Reliability of Machine Units and Details by Acoustic Emission Diagnosing
R Silin, VP Royzman, II Kovtun, AV Goroshko
Proceedings of 11th World Congress in Mechanism and Machine Science, Tianjin …, 2004
112004
Mathematical model for dynamic force analysis of printed circuit boards
II Kovtun, JM Boiko, SA Petrashchuk
Journal of Physics: Conference Series 1921 (1), 012120, 2021
82021
Reliability improvement of printed circuit boards by designing methods for solder joint technical diagnostics with application of acoustic emission method
II Kovtun, JM Boiko, SA Petrashchuk
Вісник Національного технічного університету України Київський політехнічний …, 2019
82019
Acoustic emission application for nondestructive strength diagnostics of printed circuit boards
I Kovtun, J Boiko, S Petrashchuk
Хмельницький національний університет, 2018
72018
Assessing Enclosure Case Design on Excitation and Transmission of Vibration in Electronic Packages
I Kovtun, J Boiko, S Petrashchuk
2019 IEEE 2nd Ukraine Conference on Electrical and Computer Engineering …, 2019
62019
Identification of natural frequency and form of oscillation for electronic packages subjected to vibration
I Kovtun, J Boiko, S Petrashchuk
2018 IEEE 38th International Conference on Electronics and Nanotechnology …, 2018
62018
Development of methods for acoustic emission non-destructive strength diagnostics of components and units/II Kovtun, VP Royzman
I Kovtun
Scientific collection of the National Academy of the State Border Guard …, 2015
52015
Software and hardware complex of acoustic emission
VP Roizman, II Kovtun
Measurement and computation technique in technological processes …, 1997
51997
Methods for Vibration Reduction in Enclosed Electronic Packages
I Kovtun, J Boiko, S Petrashchuk, T Kałaczyński
MATEC Web of Conferences 302, 01008, 2019
42019
Selected issues of work safety
G Kalda, K Pietrucha-Urbanik, I Kovtun
Oficyna Wydawnicza Politechniki Rzeszowskiej, 2015
42015
Calculation of mechanical stresses in adjoint system of electronic component and compound and strength assessment
V Royzman, S Petrashchuk, I Kovtun, A Lokoshchenko
Journal of Vibroengineering 15 (1), 65-71, 2013
42013
Effectiveness Improvement Method for Signal Processing in Optical Telecommunication
J Boiko, O Eromenko, I Kovtun, S Petrashchuk
2018 International Scientific-Practical Conference Problems of …, 2018
32018
Nondestructive hermetic seal diagnostics and prediction method for super-high-frequency modules
I Kovtun, J Boiko, S Petrashchuk
2018 14th International Conference on Advanced Trends in Radioelecrtronics …, 2018
32018
5.1. Acoustic emission diagnostics of solder joints on printed circuit boards
I Kovtun, V Royzman, A Voznyak
Quality and Reliability of Technical Systems: Theory and Practice, 214, 2018
32018
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